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Analysis of the experimental cooling performance of a high-power light-emitting diode package with a modified crevice-type vapor chamber heat pipe
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 Title & Authors
Analysis of the experimental cooling performance of a high-power light-emitting diode package with a modified crevice-type vapor chamber heat pipe
Kim, Jong-Soo; Bae, Jae-Young; Kim, Eun-Pil;
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The experimental analysis of a crevice-type vapor chamber heat pipe (CVCHP) is investigated. The heat source of the CVCHP is a high-power light-emitting diode (LED). The CVCHP, which exhibits a bubble pumping effect, is used for heat dissipation in a high-heat-flux system. The working fluid is R-141b, and its charging ratio was set at 60 vol.% of the vapor chamber in a heat pipe. The total thermal conductivity of the falling-liquid-film-type model, which was a modified model, was 24% larger than that of the conventional model in the LED package. Flow visualization results indicated that bubbles grew larger as they combined. These combined bubbles pushed the working fluid to the top, partially wetting the heat-transfer area. The thermal resistance between the vapor chamber and tube in the modified design decreased by approximately 32%. The overall results demonstrated the better heat dissipation upon cooling of the high-power LED package.
Crevice-type vapor chamber heat pipe;LEDs;Heat dissipation;
 Cited by
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