Advanced SearchSearch Tips
Analysis of the thermal management of a high power LED package with a heat pipe
facebook(new window)  Pirnt(new window) E-mail(new window) Excel Download
 Title & Authors
Analysis of the thermal management of a high power LED package with a heat pipe
Kim, Jong-Soo; Kim, Eun-Pil;
  PDF(new window)
The thermal management of high-power LED components in an assembly structure is crucial for the stable operation and proper luminous function. This study employs numerical tools to determine the optimum thermal design in LEDs with a heat sink consisting of a crevice-type vapor-chamber heat pipe. The effects of the MCPCB are investigated in terms of the substrate thicknesses on which the LEDs are mounted. Further, different placement configurations in a system module are considered. This study found that for a confined area, a power of 40 W/LED is applicable to a high-power package. Furthermore, the thermal conductivity of dielectric layer materials should ideally be greater than 0.9 W/m.K. The temperature conditions of the vapor chamber in a heat pipe greatly affect the thermal performance of the system. At an offset distance of 9.0 mm and a increase in the temperature of the heat pipe, the resulting maximum temperature increase is approximately for each heat dissipation temperature. Finally, at a thermal conductivity of 0.3 W/m.K, it was found that the total thermal resistance changes dramatically. Above 1.2 W/m.K, the resistance change reduces exponentially.
Vapor chamber heat pipe;LEDs;Heat dissipation;Numerical method;
 Cited by
N. Gu, Y. Narendran, and H. Hosseinzadeh, Solid-state lighting: failure analysis of white LEDs, Journal of Crystal Growth, pp. 449-456, 2004.

C. Weng, Advanced thermal enhancement and management of LED packages, International Communication in Heat and Mass Transfer, pp. 245-248, 2009.

A. Christensen and S. Graham, Thermal effects in packaging high power light emitting diode arrays, Applied Thermal Engineering, pp. 364-371, 2009.

K. C. Yung, H. Liem, H. S. Choy and W. K. Lum, Thermal performance of high brightness LED array package on PCB, International Communication in Heat and Mass Transfer, pp. 1266-1272, 2010.

S. B. Law, A. Permal and M. Devarajan, Effective heat dissipation of high power LEDs mounted on MCPCBs with different thickness of aluminum substrates, IEEE-ICSE2012, pp. 707-710, 2012.

E. Juntunen, O. Tapaninen, M. Jamsa, and V. Heikkinen, "Copper-core MCPCB with thermal vias for high-power COB LED modules," IEEE Transactions on Power Electronics, vol. 29, pp. 1410-1417, 2014. crossref(new window)

T. Yong, D. Xinrui, and Y. Binhai, L. Zongtao, and L. Bin, A high power LED divice with chips directly mounted on heat pipes, Applied Thermal Engineering, pp. 632-639, 2014.

J. S. Kim, J. Y. Bae, and E. Kim, "Analysis on the experimental cooling performance of a high power LED package with a crevice-type vapor chamber heat pipe," Journal of the Korean Society of Marine Engineering, vol. 39, no. 8, pp. 801-806, 2015. crossref(new window)

ANSYS Inc., Ver. 16,, 2015.

Lumileds Inc., Thermal management considerations for SuperFlux LEDs, 2015.