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Fracture Behavior of a Ductile Layer Sandwiched by Stiff Substrates;Finite Element Analysis
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 Title & Authors
Fracture Behavior of a Ductile Layer Sandwiched by Stiff Substrates;Finite Element Analysis
Kim, Dong-Hak; Gang, Gi-Ju;
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 Abstract
Fracture behaviors of an interface crack in a ductile layer sandwiched by rigid substrates are analyzed by finite element method. Several fracture mechanisms and the corresponding criteria are examined. And the crack growth behavior and fracture toughness are predicted. As the results, various crack growth procedures such as the crack jump to the other interface on the opposite side, the creation of a new crack far from the initial crack front, and the asymmetric relation of fracture toughness vs. mode mixity (-) can be successfully explained.
 Keywords
Fracture Toughness;Blunting of Crack Tip;Brittle Debonding;Stress Triaxiality;Damage;Cavitation;
 Language
Korean
 Cited by
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