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Cure simulation and Consolidation for a Thick Glass/Epoxy Laminate
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 Title & Authors
Cure simulation and Consolidation for a Thick Glass/Epoxy Laminate
O, Je-Hun; Lee, Dae-Gil;
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 Abstract
During the curing process of thick glass/epoxy laminates, a substantial amount of temperature lag and overshoot at the center of the laminates is usually experienced due to the large thickness and low thermal conductivity of the glass/epoxy composites. Also, it takes a longer time for full and uniform consolidation. In this work, temperature, degree of cure and consolidation of a 20 mm thick unidirectional glass/epoxy laminate were investigated using an experiment and a 3-dimentional numerical analysis. From the experimental and numerical results, it was found that the experimentally obtained temperature profile agreed well with the numerical one, and the cure cycle recommended by the prepreg manufacturer should be modified to prevent a temperature overshoot and to obtain full consolidation.
 Keywords
Thick Composite Laminates;Cure Cycle;Kinetic Model;Exothermic Reaction;Temperature Overshoot;Consolidation;
 Language
Korean
 Cited by
1.
후경화 조건에 따른 에폭시 수지의 물성에 관한 연구,한정영;김명훈;강성수;

한국생산제조학회지, 2012. vol.21. 6, pp.976-981 crossref(new window)
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