Advanced SearchSearch Tips
Ritz Analysis of Rectangular MEMS Structures (I);Formulation and Its Implementation
facebook(new window)  Pirnt(new window) E-mail(new window) Excel Download
 Title & Authors
Ritz Analysis of Rectangular MEMS Structures (I);Formulation and Its Implementation
Kim, Eun-Seok; Lee, Byeong-Chae;
  PDF(new window)
We apply the Rayleigh Ritz method to analyze multi-layered plates with residual stresses. The method is very simple, straight forward, and easily programmable, but it should be applied to structure s only in simple shapes. We derive coupled variational equations based on the principle of virtual displacement, and investigate what kind of basis functions is desirable for the analysis of rectangular plates with various boundary conditions. We demonstrate the effectiveness and usefulness of the method through several examples. The analysis results obtained with the method are in good agreement with those available in literature. A multi-layered MEMS plate example shows that the coupling effect should not be ignored and that residual stresses do influence the stiffness of the structure very much.
MEMS Structure;Ritz Method;Multi-Layered Plate;Deformation Coupling;Residual Stress;
 Cited by
Reddy, J. N., 1997, Mechanics of Laminated Composite Plates, Theory and Analysis, CRC Press, New York

Ambartsumyan, S. A. and Kunin, I., 1991, Theory of Anisotropic Plates, Strength, Stability, and Vibrations. 2nd Ed. Hemisphere Pub. New York

Ritz, W., 1909, 'Ueber eine Methode zur Loesung Gewisser VariationSprebleme der Mathematischen Physik,' J. Reine Angew. Math., Vol. 135, 1-61

Timoshenko, S. and Woinowsky, Krieger S., 1959, Theory of Plates and Shells. 2nd Ed. Mc Graw Hill, New York

Chang, C. C. and Conway, H. D.,1952, 'The Marcus Method Applied to Solution of Uniformly Loaded and Clamped Rectangular Plate Subjected to Forces in Its Plane,' J. of Appl. Mech., Vol. 19, 179-194

Ried, R. P., Kim, E. S., Hong, D. M. and Muller, R. S., 1993, 'Piezoelectric Microphone with On-Chip CMOS Circuits,' IEEE/ASME J. of Microelectromechanical Systems, Vol. 2, 111-120 crossref(new window)