JOURNAL BROWSE
Search
Advanced SearchSearch Tips
A Study on tole Improvement of the Slurry Dispersibility in CMP
facebook(new window)  Pirnt(new window) E-mail(new window) Excel Download
 Title & Authors
A Study on tole Improvement of the Slurry Dispersibility in CMP
Jo, Seong-Hwan; Kim, Hyeong-Jae; Kim, Ho-Yun; Seo, Heon-Deok; Kim, Gyeong-Jun;
  PDF(new window)
 Abstract
This study presents the possibility of scratch reduction on wafer in CMP by applying the ultrasonic and megasonic energy into the slurry which might contain large abrasive particles. Experiments were conducted to verify the dispersion ability of agglomerated particles by applying ultrasonic, megasonic waves and analyze the particle distribution of used slurry in case, of sonic energy assisted or none. And the dispersion stability of megasonic waves was investigated through the experiment of stability of the dispersed slurry, Finally, to confirm that the distribution of particles in slurry by ultrasonic waves was actually related to scratches on wafer when CMP was done, tungsten blanket wafer was processed, by CMP to compare and investigate scratches on wafer.
 Keywords
CMP;Dispersion;ILD;Megasonic;Ultrasonic;blanket wafer;
 Language
Korean
 Cited by
1.
화학기계적 연마 프로세스의 동적 열전달 모델링 연구,석종원;

대한기계학회논문집A, 2004. vol.28. 5, pp.617-623 crossref(new window)
2.
사파이어 웨이퍼의 기계-화학적인 연마 가공특성에 관한 연구,신귀수;황성원;서남섭;김근주;

대한기계학회논문집A, 2004. vol.28. 1, pp.85-91 crossref(new window)
3.
GaN 증착용 사파이어 웨이퍼의 표면가공에 따른 압흔 특성,신귀수;황성원;김근주;

대한기계학회논문집A, 2005. vol.29. 4, pp.632-638 crossref(new window)
 References
1.
Jeong, H. D., 1996, 'Development of CMP Process for Global Planarization of ULSI,' Journal of the Korean Society of Mechanical Engneers, 36(3), pp. 220-230

2.
Li, S. H. and Miller, R. O., 1997, 'Chemical Mechanical Polishing in Silicon Processing,' pp. 140-146

3.
Haung, J., Chen, H. C., Wu, J. Y. and Lur, W., 1999, 'Investigation of CMP Micro-Scratch in the Fabrication of Sub-Quarter Micron VLSI Circuits,' CMP-MIC Conference, pp. 77-79

4.
Vasilopoulos, G., 1998, 'Central Distribution System of CMP Slurries Using Planargard Filters,' Millipore, Microelectronics Application News, pp. 76-79

5.
Hipp, A. K., Storti, G. and Morbidelli, M., 1999, 'Particle Sizing in Colloidal Dispersions by Ultrasound. Model Calibration and Sensitivity Analysis,' American Chemical Society, pp. 2338-2345

6.
Hatanaka, S. I., Taki, T., Kuwabara, M., Sano, M. and Asai, S., 1993, 'Effect of Process Parameter on Ultrasonic Separation of Dispersed Particle in Liquid,' Japanese Journal of Applied Physics, Vol. 38, No. 5B, pp. 3096-3100

7.
Fisher, M. L., Misra, A., Schmidt, B., Norbert, J. and Morrison, W., 2001 'Effects of Temperature and Shear History on CMP Slurry Quality and their Relation to Wafer Polish Performance,' CMP-MIC Conference, pp. 204-211