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Thermal analysis of the wafers in LPCVD process
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 Title & Authors
Thermal analysis of the wafers in LPCVD process
Kim, Il-Gyeong; Jeong, Min-Cheol; Yu, Seung-Il; Chae, Seung-Gi; Kim, U-Seung; Nam, Gi-Heum;
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In the LPCVD reactor the temperature variations within the wafer load are the most important factor to maintain the thickness of the materials deposited on the surface of the wafer constant and to affect the deformation of each wafer. In this study the temporal variations of radial and axial temperature nonuniformities of each wafer in the LPCVD reactor are numerically estimated by assuming diffuse reflection. To verify the validity of the present numerical results, the present results obtained from the transient analysis are compared with those of Badgwell's work in which a steady-state condition was assumed. The main objective of this work is to determine the temporal variations of the temperature of each wafer in the LPCVD process since the wafers experience severe change in temperature in the early stage of the process.
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