Cooling characteristics of the multichip module using paraffin slurry

Title & Authors
Cooling characteristics of the multichip module using paraffin slurry
Jo, Geum-Nam; Choe, Min-Gu;

Abstract
The present study investigated the effects of the experimental parameters on the cooling characteristics of the multichip module cooled by the indirect liquid cooling method using water and paraffin slurry. The experimental parameters are mass fraction of 2.5 ~ 7.5% for paraffin slurry, heat flux of 10 ~ 40 W/cm$\small{^{2}}$ for the simulated VLSI chips and Reynolds numbers of 5,300 ~ 15,900. The apparatus consisted of test section, paraffin slurry maker, pump, constant temperature baths, flowmeter, etc. The test section made of in-line, four-row array of 12 heat sources for simulating 4 * 3 multichip module which was flush mounted on the top wall of a horizontal rectangular channel with the aspect ratio of 0.2. The inlet temperature was 20 deg. C for all experiments. The size of paraffin slurry was constant as 10 ~ 40 .mu.m befor and after the experiment. The chip surface temperatures for paraffin slurry with the mass fraction of 7.5% showed lower by 16 deg. C than those for water when the heat flux is 40 W/cm$\small{^{2}}$. The local heat transfer coefficients for the paraffin slurry with the mass fraction of 7.5% were larger by 17 ~ 25% than those for water at the first and the fourth row. The local heat transfer coefficients reached to a row-number-independent, thermally fully developed value approximately after the third row. The local Nusselt numbers at the fourth row for paraffin slurry with the mass fraction of 7.5% were larger by 23 ~ 29% than those for water.
Keywords
Language
Korean
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