JOURNAL BROWSE
Search
Advanced SearchSearch Tips
Mixed Convection Transport from a Module on the Bottom Surface of Three Dimensional Channel
facebook(new window)  Pirnt(new window) E-mail(new window) Excel Download
 Title & Authors
Mixed Convection Transport from a Module on the Bottom Surface of Three Dimensional Channel
Lee, Jin-Ho; Park, Sang-Hee; Riu, Kap-Jong; Bang, Chang-Hoon;
  PDF(new window)
 Abstract
Conjugate heat transfer from a heat generating module () bonded through the module support on the floor of a parallel-plate channel(20mm high, 400mm wide, and 800mm long) to mixed convective air flow(0.20.9m/s) is studied experimentally. The input power to the module is changed in a range 1.04.5W, the floor thickness 0.25mm, and the thermal resistance of module support, Rc:=0.06, 1.03 and 82.0K/W. Thermal conductance(Uc) of the board and convective thermal conductance() from the module were derived, and the effect of V; Rc and t on Uc was investigated. It is found that the conjugate conductance (Uc) and the conductive heat transfer ratio (/Q) depend on the thermal resistance of the module support, the air velocity and the board thickness. The change of the module support resistance and the board thickness helps to elucidate the relative significance of heat transfer paths through the module support, the board, and from the board surface to the air. Additional information is investigated about the dependence of the heat transfer rate on the mixed convection parameter
 Keywords
Conjugate Heat Transfer;Mixed Convection;Thermal Resistance;Module;Board;Thermal Conductance;
 Language
Korean
 Cited by
 References
1.
Ostrach S., 1954, 'Combined Natural and Forced Convection Laminar Flow and Heat Transfer of Fluids with without Heat Sources in Channels With Linearly Varying Wall Temperature,' NACA TN3141

2.
Shaw H. J., Chen W. L., and Chen C. K., 1991, 'Study on the Laminar Mixed Convective Heat Transfer in Three-Dimensional Channel With a Thermal Source,' Journal of Electronic Packaging, Vol. 113, pp. 40-49

3.
Kang B. H., and Jaluria Y., 1990, 'Mixed Convection Transport from an Isolated Heat Source Module on a Horizontal Plate,' Journal of Heat Transfer, Vol. 112, pp. 653-661

4.
Kang B. H., and Jaluria Y., 1989, 'Mixed Convection Transport from an Isolated Heat Source Module on a Vertical Surface,' Journal of Thermophysics, Vol. 4, pp. 384-390

5.
Park H. Y., and Park K. W., 1995, 'A Numerical Study on the Effect of PCB Structure Variation the Electronic Equipment Cooling,' KSME International Journal, Vol. 19, pp. 3329-3343

6.
Ray S., and Srinivasan J., 1992, 'Analysis of Conjugate Laminar Mixed Cooling in a Shrouded Array of Electronic Components,' Int. J. Heat Mass Transfer, Vol. 35, No. 4, pp. 815-822 crossref(new window)

7.
Graham K., and Witzman S., 1988, 'Analytical Correlation of Thermal Design of Electronic Packages,' Cooling Technology for Electronic Equipment, pp. 249-264

8.
Nakayama W., and Park S. H., 1996, 'Conjugate Heat Transfer from a Single Surface Mounted Block to Forced Convective Air Flow in a Channel,' Journal of Heat Transfer, Vol. 118, pp. 301-309

9.
Park S. H., and Nakayama W., 1995, 'Conjugate-Mode Heat Transfer from a Module on the Base of a Parallel-Plate Channel to Forced Convective Air Flow (Experimental Determination of Macroscopic Thermal Conductance),' Trans. of the Japan Society of Mechanical Engineers, Vol. 61, No. 583, B, pp. 1070-1077

10.
유갑종, 이진호, 박상희, 1998, '채널벽면에 탑재된 모듈로부터 혼합대류 공기류로의 복합열전달,' 대한기계학회 춘계학술대회논문집, pp. 122-127

11.
박상희, 이진호, 유갑종, 1998, '열전도체 기판에 탑재된 정방형 모듈로부터 혼합대류 공기류로의 복합열전달,' 대한기계학회 추계학술대회논문집, pp. 241-245

12.
Kim S. Y., Sung H. J., and Hyun J. M., 1992, 'Mixed Convection from Multiple-Layered Boards with Cross-Stream wise Periodic Boundary Conditions,' Int. J. Heat Mass Transfer, Vol. 35, No. 11, pp. 2941-2952 crossref(new window)

13.
윤병택, 최도형, 1999, '기판위에 분포된 발열블록주위의 3차원 혼합대류열전달 해석,' 대한기계학회 논문집B집, 제23권 제1호, pp. 1-11