Mixed Convection Transport from a Module on the Bottom Surface of Three Dimensional Channel

Title & Authors
Mixed Convection Transport from a Module on the Bottom Surface of Three Dimensional Channel
Lee, Jin-Ho; Park, Sang-Hee; Riu, Kap-Jong; Bang, Chang-Hoon;

Abstract
Conjugate heat transfer from a heat generating module ($\small{31{\times}31{\times}7mm^3}$) bonded through the module support on the floor of a parallel-plate channel(20mm high, 400mm wide, and 800mm long) to mixed convective air flow(0.2$\small{{\sim}}$0.9m/s) is studied experimentally. The input power to the module is changed in a range 1.0$\small{{\sim}}$4.5W, the floor thickness 0.2$\small{{\sim}}$5mm, and the thermal resistance of module support, Rc:=0.06, 1.03 and 82.0K/W. Thermal conductance(Uc) of the board and convective thermal conductance($\small{U_A}$) from the module were derived, and the effect of V; Rc and t on Uc was investigated. It is found that the conjugate conductance (Uc) and the conductive heat transfer ratio ($\small{Q_B}$/Q) depend on the thermal resistance of the module support, the air velocity and the board thickness. The change of the module support resistance and the board thickness helps to elucidate the relative significance of heat transfer paths through the module support, the board, and from the board surface to the air. Additional information is investigated about the dependence of the heat transfer rate on the mixed convection parameter
Keywords
Conjugate Heat Transfer;Mixed Convection;Thermal Resistance;Module;Board;Thermal Conductance;
Language
Korean
Cited by
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