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Development of Uniform Press for Wafer Bonder
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 Title & Authors
Development of Uniform Press for Wafer Bonder
Lee, Chang-Woo; Ha, Tae-Ho; Lee, Jae-Hak; Kim, Seung-Man; Kim, Yong-Jin; Kim, Dong-Hoon;
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The bonding process should be achieved in vacuum environment to avoid air bubble. In this study, we studied about pressure uniformity that became an issue in thermo compression bonding usually. Uniform press is realized by the method that use air spring and metal form spring. The concept of uniform press using air spring is removed except pressing direction in the press processing so angle between the vector of pressure surface and the pressure axis is parallel automatically. Air spring compensate the errors of machining and assembly. Metal form compensate the thermal deformation and flatness error.
Uniform Press;Wafer Bonder;Ultra Thin Wafer;3D Package;Temporary Bonding;De-bonding;
 Cited by
Yole Development Report, 2012 "Equipment & Materials for 3DIC and Wafer-Level_Packaging."

Yole Development Report, 2011 "Thin Wafer Manufacturing Equipment & Materials Markets."

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Lee, J. H., Song, J. Y., Kim, H. J., Kim, S. M., Ha, T. H., Lee, C. W., 2014, "Study On Pressure Uniformity of Wafer Bonder," 한국정밀공학회 춘계학술대회 논문집, p. 1057.