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Development of Uniform Press for Wafer Bonder
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 Title & Authors
Development of Uniform Press for Wafer Bonder
Lee, Chang-Woo; Ha, Tae-Ho; Lee, Jae-Hak; Kim, Seung-Man; Kim, Yong-Jin; Kim, Dong-Hoon;
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 Abstract
The bonding process should be achieved in vacuum environment to avoid air bubble. In this study, we studied about pressure uniformity that became an issue in thermo compression bonding usually. Uniform press is realized by the method that use air spring and metal form spring. The concept of uniform press using air spring is removed except pressing direction in the press processing so angle between the vector of pressure surface and the pressure axis is parallel automatically. Air spring compensate the errors of machining and assembly. Metal form compensate the thermal deformation and flatness error.
 Keywords
Uniform Press;Wafer Bonder;Ultra Thin Wafer;3D Package;Temporary Bonding;De-bonding;
 Language
Korean
 Cited by
 References
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