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Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint
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  • Journal title : Journal of Welding and Joining
  • Volume 34, Issue 1,  2016, pp.26-34
  • Publisher : The Korean Welding and Joining Society
  • DOI : 10.5781/JWJ.2016.34.1.26
 Title & Authors
Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint
Bang, Jung-Hwan; Yu, Dong-Yurl; Ko, Young-Ho; Yoon, Jeong-Won; Lee, Chang-Woo;
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Automotive today has been transforming to an electronic product by adopting a lot of convenience and safety features, suggesting that joining materials and their mechanical reliabilities are getting more important. In this study, a Sn-Cu-Cr-Ca solder composition having a high melting temperature (>) was fabricated and its joint properties and reliability was investigated with an aim to evaluate the suitability as a joining material for electronics of engine room. Furthermore, mechanical properties change under complex environment were compared with several existing solder compositions. As a result of contact angle measurement, favorable spreadability of 84% was shown and the average shear strength manufactured with corresponding composition solder paste was . Also, thermo-mechanical reliability by thermal shock and vibration test was compared with that of the representative high temperature solder materials such as Sn-3.5Ag, Sn-0.7Cu, and Sn-5.0Sb. In order to fabricate the test module, solder balls were made in joints with ENIG-finished BGA and then the BGA chip was reflowed on the OPS-finished PCB pattern. During the environmental tests, resistance change was continuously monitored and the joint strength was examined after tests. Sn-3.5Ag alloy exhibited the biggest degradation rate in resistance and shear stress and Sn-0.7Cu resulted in a relatively stable reliability against thermo-mechanical stress coming from thermal shock and vibration.
Lead-free solder;Vehicle;ELV(End-of-Life Vehicle);Complex stress;Reliability;
 Cited by
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