Advanced SearchSearch Tips
Characterization of Inkjet-Printed Silver Patterns for Application to Printed Circuit Board (PCB)
facebook(new window)  Pirnt(new window) E-mail(new window) Excel Download
 Title & Authors
Characterization of Inkjet-Printed Silver Patterns for Application to Printed Circuit Board (PCB)
Shin, Kwon-Yong; Lee, Minsu; Kang, Heuiseok; Kang, Kyungtae; Hwang, Jun Young; Kim, Jung-Mu; Lee, Sang-Ho;
  PDF(new window)
In this paper, we describe the analysis of inkjet-printed silver (Ag) patterns on epoxy-coated substrates according to several reliability evaluation test method guidelines for conventional printed circuit boards (PCB). To prepare patterns for the reliability analysis, various regular test patterns were created by Ag inkjet printing on flame retardant 4 (FR4) and polyimide (PI) substrates coated with epoxy for each test method. We coated the substrates with an epoxy primer layer to control the surface energy during printing of the patterns. The contact angle of the ink to the coated epoxy primer was , and its surface energy was 18.6 . Also, the substrate temperature was set at . We were able to obtain continuous line patterns by inkjet printing with a droplet spacing of . The reliability evaluation tests included the dielectric withstanding voltage, adhesive strength, thermal shock, pressure cooker, bending, uniformity of line-width and spacing, and high-frequency transmission loss tests.
Inkjet;Reliability;Silver;Printed circuit board;Epoxy;
 Cited by
Mechanical and thermal reliability of conductive circuits inkjet printed on flexible substrates, Circuit World, 2017, 43, 1, 9  crossref(new windwow)
RF performance of ink-jet printed microstrip lines on rigid and flexible substrates, Microelectronic Engineering, 2017, 168, 82  crossref(new windwow)
Henning Meier, Ute Loffelmann, Dario Mager, Patrick J. Smith, and Jan G. Korvink, "Inkjet printed, conductive, 25 $\mu$m wide silver tracks on unstructured polyimide", Physica Status Solidi A, Vol. 206, pp. 1626, 2009. crossref(new window)

Paul C. Duineveld, "The stability of ink-jet printed lines of liquid with zero receding contact angle on a homogeneous substrate", jof Fluid Mechanics, Vol. 477, pp. 175-200, 2003.

Thijh H. J. van Osch, Jolke Perelaer, Antonius W. M. de Laat, Ulrich S. Schubert, "Inkjet Printing of Narrow Conductive Tracks on Untreated Polymeric Substrates", Advanced Materials, Vol. 20, pp. 343, 2008. crossref(new window)

Dongjo Kim, Sunho Jeong, Bong Kyun Park, and Jooho Moon, "Direct writing of silver conductive patterns: Improvement of film morphology and conductance by controlling solvent compositions", Applied Physics Letters, Vol. 89, pp. 264101, 2006. crossref(new window)

Berend-Jan de Gans, and Ulrich S. Schubert, "Inkjet Printing of Well-Defined Polymer Dots and Arrays", Langmuir, Vol. 20, pp. 7789-7793, 2004. crossref(new window)

Robert D. Deegan, Olgica Bakajin, Todd F. Dupont, Greg Huber, Sidney R. Nagel, and Tomas A. Witten, "Contact line deposits in an evaporating drop", Physical Review E, Vol. 62, pp. 756-765, 2000. crossref(new window)

D.B. van Dam, and J.G.M. Kuerten, "Modeling the Drying of Ink-Jet-Printed Structures and Experimental Verification", Langmuir, Vol. 24, pp. 582-589, 2008. crossref(new window)

Dan Soltman and Vivek Subramanian, "Inkjet-Printed Line Morphologies and Temperature Control of the Coffee Ring Effect", Langmuir, Vol. 24, pp. 2224, 2008. crossref(new window)

Tang, K. C., Liao, E., Ong, W. L., Wong, J. D. S., Agarwal, A., Nagarajan, R., Yobas, L., "Evaluation of bonding between oxygen plasma treated polydimethyl siloxane and passivated silicon", Journal of Physics, vol. 34, PP. 155-161, 2006.

Sang-Ho Lee and Young-June Cho, "Characterization of Silver Inkjet Overlap-Printing through Cohesion and Adhesion", Journal of Electrical Engineering and Technology, vol. 7, pp. 91-96, 2012. crossref(new window)

Markus, P. K. Turunen, Pekka Marjamaki, Matti Paajanen, Jouko Lahtinen, Jorma K. Kivilahti, "Pulloff test in the assessment of adhesion at printed wiring board metallization/epoxy interface", Journal of Microelectronics Reliability, Vol. 44, pp. 993-1007, 2004. crossref(new window)

Inyoung Kim, Young An Song, Hyun Chul Jung, Jea Woo Joung, Sung-Soo Ryu and Jongryoul Kim, "Effect of Microstructural Development on Mechanical and Electrical Properties of Inkjet-Printed Ag Films", Journal of Electronic Material Vol. 37, No. 12, 2008.

Kwon-Yong Shin, Sang Ho Lee, Je Hoon Oh, "Solvent and substrate effects on inkjet-printed dots and lines of silver nanoparticle colloids", J. Micromech. Microeng. Vol. 21, pp. 11, 2011.

Allen F. Horn, III, John W. Reynolds, James C Rautio, "Conductor Profile Effects on the Propagation Constant of Microstrip Transmission Lines", International Microwave Symposium Digest (MTT), 2010 IEEE MTT-S, pp. 868-871, 2010.