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Electro-Thermal Modeling and Experimental Validation of Integrated Microbolometer with ROIC
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 Title & Authors
Electro-Thermal Modeling and Experimental Validation of Integrated Microbolometer with ROIC
Kim, Gyungtae; Kim, Taehyun; Kim, Hee Yeoun; Park, Yunjong; Ko, Hyoungho;
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This paper presents an electro-thermal modeling of an amorphous silicon (a-Si) uncooled microbolometer. This modeling provides a comprehensive solution for simulating the electro-thermal characteristics of the fabricated microbolometer and enables electro-thermal co-simulation between MEMS and CMOS integrated circuits. To validate this model, three types of uncooled microbolometers were fabricated using a post-CMOS surface micromachining process. The simulation results show a maximum discrepancy of 2.6% relative to the experimental results.
Microbolometer;infrared (IR) sensor;electro-thermal modeling;
 Cited by
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