Publisher : The Korean Institute of Electrical and Electronic Material Engineers
DOI : 10.4313/TEEM.2015.16.6.351
Title & Authors
Highly Thermal Conductive Alumina Plate/Epoxy Composite for Electronic Packaging Jeong, Un Seong; Lee, Yoon Joo; Shin, Dong Geun; Lim, Hyung Mi; Mun, So Youn; Kwon, Woo Teck; Kim, Soo Ryong; Kim, Young Hee; Shim, Kwang Bo;
In this study, alumina plates 9~25 μm in size were used as thermal fillers, and epoxy resin was used as a polymer matrix. Oriented alumina plate/epoxy composites were prepared using a rolling method. The effect of ordering alumina plates increased with alumina plate size. The thermal conductivity and flexural strength of the composites were investigated. The horizontal thermal conductivity of the oriented composite was significantly higher than the vertical thermal conductivity. The horizontal thermal conductivity of the 75 wt% alumina content was 8.78 W/mk, although the vertical thermal conductivity was 1.04 W/mk. Ordering of the alumina plate using a rolling method significantly improved the thermal conductivity in the horizontal direction. The flexural strengths of the ordered alumina/epoxy composites prepared at different curing temperatures were measured.