Publisher : The Korean Institute of Electrical and Electronic Material Engineers
DOI : 10.4313/TEEM.2016.17.3.129
Title & Authors
Analysis of Pull-in-Voltage and Figure-of-Merit of Capacitive MEMS Switch Saha, Rajesh; Maity, Santanu; Devi, Ngasepam Monica; Bhunia, Chandan Tilak;
Theoretical and graphical analysis of pull-in-voltage and figure of merit for a fixed-fixed capacitive Micro Electromechanical Systems (MEMS) switch is presented in this paper. MEMS switch consists of a thin electrode called bridge suspended over a central line and both ends of the bridge are fixed at the ground planes of a coplanar waveguide (CPW) structure. A thin layer of dielectric material is deposited between the bridge and centre conductor to avoid stiction and provide low impedance path between the electrodes. When an actuation voltage is applied between the electrodes, the metal bridge acquires pull in effect as it crosses one third of distance between them. In this study, we describe behavior of pull-in voltage and figure of merit (or capacitance ratio) of capacitive MEMS switch for five different dielectric materials. The effects of dielectric thicknesses are also considered to calculate the values of pull-in-voltage and capacitance ratio. This work shows that a reduced pull-in-voltage with increase in capacitance ratio can be achieved by using dielectric material of high dielectric constant above the central line of CPW.
Figure of merit;MEMS;Pull-in-voltage;
G. M. Rebeiz, RF MEMS Theory, Design, and Technology (New York, J. Wiley & Sons, 2003)
F. Lin, M. Wang, and M. Rais-Zadeh, Wireless Research Collaboration Symposium (NWRCS), 2014 National, p. 11-14.
K. Topalli, M. Unlu, H. I. Atasoy, O. A. Civi, S. Demir, and T. Akin, Prog. in Electromagnetic Research, PIER 97, 343 (2009). [DOI: http://dx.doi.org/10.2528/PIER09092502]
A. Kundu, S. Das, S. Maity, B. Gupta, S. K. Lahiri, and H. Saha, Journal of Micromechanics and Microengineering, 22, 045004 (2013). [DOI: http://dx.doi.org/10.1088/0960-1317/22/4/045004]
R. Saha, S. Maity, and C. T. Bhunia, Alexandria Engineering Journal, 55 (2016). [DOI: http://dx.doi.org/10.1016/j.aej.2016.05.002]
Ng. M. Devi, S. Maity, R. Saha, and S. K. Metya, Cogent Engineering, 2, 1083641 (2015). [DOI: http://dx.doi.org/10.1080/23311916.2015.1083641]
S. Das, A. Kundu, S. Maity, S. Dhar, and B. Gupta, 11th Mediterranean Microwave Symposium (MMS), 286-289 (2011). [DOI: http://dx.doi.org/10.1109/MMS.2011.6068582]
C. W. Jung, M. J. Lee, G. P. Li, and F. D. Flaviis, IEEE Transaction on Antennas and Propagation, 54, 455 (2006). [DOI: http://dx.doi.org/10.1109/TAP.2005.863407]
M. Maheswaran, M. Nambirajan, U.C.C. Yadav, and H. N. Upadhyay, Journal of Applied Sciences, 12, 1730 (2012). [DOI: http://dx.doi.org/10.3923/jas.2012.1730.1733]
S. Flores, E. R. Ruelas, M. Flores, and J. C. Chiao, Proc. of the MRS Materials Society Fall Meeting (Boston, 2003) p. A5.86.1-A5.863.
P. Verma and S. Singh, IOSR Journal of Electronics and Communication Engineering, 4, 60 (2013). [DOI: http://dx.doi.org/10.9790/2834-0456068]
G. N. Nielson and G. Barbastathis, J. Microelectromech Syst., 15, 811 (2006). [DOI: http://dx.doi.org/10.1109/JMEMS.2006.879121]
D. C. Ferguson, Mater. Design, 22, 555 (2001). [DOI: http://dx.doi.org/10.1016/S0261-3069(01)00016-4]
S. Senturia, Microsystem Design (Kluwer Academic Publishers, 2001).
J. M. Huang, K. M. Liew, C. H. Wong, S. Rajendran, M. J. Tan, and A. Q. Liu, Sensors and Actuators, A, 93, 273 (2001). [DOI: http://dx.doi.org/10.1016/S0924-4247(01)00662-8]