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A Study on the Thermal Oxidation and Wettability of Lead-free Solders of Sn-Ag-Cu and Sn-Ag-Cu-In
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 Title & Authors
A Study on the Thermal Oxidation and Wettability of Lead-free Solders of Sn-Ag-Cu and Sn-Ag-Cu-In
Lee, Hyunbok; Cho, Sang Wan;
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 Abstract
The surface oxidation mechanism of lead-free solder alloys has been investigated with multiple reflow using X-ray photoelectron spectroscopy. It was found that the solder surface of Sn-Ag-Cu-In solder alloy is surrounded by a thin layer after reflow process; this coating protects the metallic surface from thermal oxidation. Based on this result, we have performed a wetting balance test at various temperatures. The Sn-Ag-Cu-In solder alloy shows characteristics of both thermal oxidation and wetting balance better than those of Sn-Ag-Cu solder alloy. Therefore, Sn-Ag-Cu-In solder alloy is a good candidate to solve the two problems of easy oxidation and low wettability, which are the most critical problems of Pb-free solders.
 Keywords
Pb-free solder;Alloys;Oxidation;Wettability and XPS;
 Language
English
 Cited by
1.
Electron Microscopy of the Tin-oxide Nanolayer Formed on the Surface of Sn-Ag-Cu Alloys, IOP Conference Series: Materials Science and Engineering, 2017, 196, 012006  crossref(new windwow)
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