JOURNAL BROWSE
Search
Advanced SearchSearch Tips
Properties of Liquid Chemical Grouting Material for Soil Grouting using Non-cement Binder
facebook(new window)  Pirnt(new window) E-mail(new window) Excel Download
 Title & Authors
Properties of Liquid Chemical Grouting Material for Soil Grouting using Non-cement Binder
Lee, Jae-Hyun; Kim, Yong-Ro; Kim, Gyu-Yong; Yoon, Seong-Jin; Mun, Kyoung-Ju;
  PDF(new window)
 Abstract
In this research, characteristic properties of gel time and homo gel strength of liquid chemical grouting material for soil grouting using non-cement binder(NCB) were measured according to kinds of liquid B's Binders, W/B of liquid B's Binders and the volume ratio between liquid A and liquid B in order to examine on the applicability of soil grouting material using non-cement binder. The test was performed using NCB-1, NCB-2, NCB-3 which are environment-friendly inorganic binders developed by means of collaboration by our research team and which are different from chemical composition ratio each other. In conclusion, it was found that NCB could be applied to liquid soil grouting material using non-cement binder and replace ordinary portland cement, because NCB had the most excellent performance in certain section of gel time and homo gel strength in condition of this experiment.
 Keywords
liquid chemical grouting material;non-cement binder;gel time;homo gel strength;
 Language
Korean
 Cited by
 References
1.
Kim JC. A study on the injection properties of ultrafine cement grouting materials [dissertation]. [Seoul(Korea)]: Hanyang University; 1999. 139 p.

2.
Han US. Strength development characteristics of inorganic ground injection material(NDS) [master's thesis]. [Seoul(Korea)]: Hanyang University; 2012. 50 p.

3.
Cho YH. A study on the characteristics of alkali silicasol grouting material [master's thesis]. [Seoul(Korea)]: Hanyang University; 2011. 40 p.

4.
Kim YH. A study on engineering characteristics of alkali silicasol grout material [dissertation]. [Seoul(Korea)]: Hanyang University; 2014. 94 p.