Advanced SearchSearch Tips
Green Photoresist Stripping Process with the Influence of Free Surface from Dip Withdrawal
facebook(new window)  Pirnt(new window) E-mail(new window) Excel Download
 Title & Authors
Green Photoresist Stripping Process with the Influence of Free Surface from Dip Withdrawal
Kim, Joon Hyun; Kim, Seung Hyun; Jeong, Byung Hyun; Joo, Gi-Tae; Kim, Young Sung;
  PDF(new window)
This paper describes a green stripping process to effectively strip the remaining DFR layer on a non-alkali-based ITO glass surface after an etching process. A stripper, water-soluble amine compound, is used to investigate the characteristics of stripping ability and to suggest a valid method for the green process. Increasing the composition (5-30% concentration) of the ethanol amine-based stripper was found to greatly reduce the stripping time applied in the dipping method. The composition (30%) achieved an excellent stripping effect and free-residue impurities. Additionally, it was possible to obtain the effect of stripping in a way to sustain the release before generating DFR sludge from the ITO glass surface by using dipping condition (stripping time) in the composition. An Additional stripping process (buffering) out of dipping can realize productivity improvement and cost reduction because of the higher proportion of re-use of the stripping solution used in the DFR removal step.
Dip coatings;Formulation;ITO Glass;Photoresist;Stripping process;
 Cited by
An Efficient Photoresist Stripping Process on the ITO Surface Using the Dipping Method, Journal of the Korean Society of Manufacturing Technology Engineers, 2016, 25, 4, 281  crossref(new windwow)
Lee, H. K., Lee, I. G., Park, M.-J., Koo, K. K., Cho, Y. J., Cho, B. G., 2013, Technical Trend on the Recycling Technologies for Stripping Process Waste Solution by the Patent and Paper Analysis, Journal of the Korean Institute of Resources Recycling, 22:4 81-90.

Kentish, S. E., Stevens, G. W., 2001, Innovations in Separations Technology for the Recycling and Re-use of Liquid Waste Streams, Chemical Engineering Journal, 84:2 249-159.

Moon, S. H., Chai, S. H., 2009, A Study on Recycling Technology of EC for Semiconductor and LCD PR Stripping Process, Journal of the Institute of Electronics and Information Engineer, 46:10 25-30.

Eotech, viewed 18 August 2015, .

Wilson, S. D. R., 1982, The Drag-out Problem in Film Coating Theory, Journal of Engineering Mathematics, 16:3 209-221. crossref(new window)

Maleki, M., Reyssatb, M., Restagnoc, I., Quereb, D., Clanetd, C., 2011, Landau-levich Menisci, Journal of Colloid and Interface Science, 354:1209-221.