Publisher : The Materials Research Society of Korea
DOI : 10.3740/MRSK.2015.25.12.719
Title & Authors
Effects of Poly(Styrene-Co-Maleic acid) as Adhesion Promoter on Rheology of Aqueous Cu Nanoparticle Ink and Adhesion of Printed Cu Pattern on Polyimid Film Jo, Yejin; Seo, Yeong-Hui; Jeong, Sunho; Choi, Youngmin; Kim, Eui Duk; Oh, Seok Heon; Ryu, Beyong-Hwan;
For a decade, solution-processed functional materials and various printing technologies have attracted increasingly the significant interest in realizing low-cost flexible electronics. In this study, Cu nanoparticles are synthesized via the chemical reduction of Cu ions under inert atmosphere. To prevent interparticle agglomeration and surface oxidation, oleic acid is incorporated as a surface capping molecule and hydrazine is used as a reducing agent. To endow water-compatibility, the surface of synthesized Cu nanoparticles is modified by a mixture of carboxyl-terminated anionic polyelectrolyte and polyoxylethylene oleylamine ether. For reducing the surface tension and the evaporation rate of aqueous Cu nanoparticle inks, the solvent composition of Cu nanoparticle ink is designed as DI water:2-methoxy ethanol:glycerol:ethylene glycol
aqueous Cu nanoparticle ink;inkjet printing;poly(styrene-co-maleic acid);rheology;adhesion of printed Cu pattern;
S. Jeong, H. Song, W. Lee, S. Lee, Y. Choi, W. Son, E. Kim, C. Paik, S. Oh, and B. Ryu, Langmuir, 27, 3144 (2011).
Y. Choi and S. Hong, Langmuir, 31, 8101 (2015).
G. L. Draper, R. Dharmadasa, M. E. Staats, B. W. Lavery and T. Druffel, ACS Appl. Mater. Interfaces, 7, 16478 (2015).
J. Park, G. Kang, H. Ahn and L. Guo, J. Adv. Mater., 22, E247 (2010).
Y. Li, Y. Wu and B. Ong, J. Am. Chem. Soc., 127, 3266 (2005).
H. Sirringhaus, T. Kawase, R. H. Friend, T. Shimoda, M. Inbasekaran, W. Wu and P. Woo, Science, 290, 2123 (2000).
R. K. Holman, S. A. Uhland, M. Cima and J. E. Sachs, J. Colloid Interface Sci., 247, 266 (2002).
P. Chantal, J. Robert, K. Arnold, M. Olga, F. Julie, L. Sylvie and M. Patrick. Org. Electron., 15, 1836 (2014).
P. Buffat and J. P. Borel, Phys. Rev. A: At. Mol. Opt. Phys., 13, 2287 (1976).
S. Jeong, K. Woo, D. Kim, S. Lim, J. S. Kim, H. Shin, Y. Xia and J. Moon, Adv. Funct. Mater., 18, 679 (2008).
S. Gamerith, A. Klug, H. Scheiber, U. Scherf, E. Moderegger and E. J. List, Adv. Funct. Mater., 17, 3111 (2007).
K. Woo, D. Kim, J. S. Kim, S. Lim and J. Moon, Langmuir, 25, 429 (2009).
B. J. Gans, ; U. S. Schubert, Langmuir, 20, 7789 (2004).
D. Soltman and V. Subramanian, Langmuir, 24, 2224 (2008).
R. Prucek, L. Kvitek, A. Panacek, L. Vancurova, J. Soukupova, D. Jancik and R. J. Zboril, Mater. Chem., 19, 8463 (2009).
B. Escaig, J. de Physique IV, 03(C7), C7-753 (1993).
J. D. Venables, J. Mater. Sci., 19, 2431 (1984).
G. Ramarathnam, M. Libertucci, M. M. Sadowski and T. H. North, Weld. Res. Suppl., 12, 483S (1992).