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Effects of Poly(Styrene-Co-Maleic acid) as Adhesion Promoter on Rheology of Aqueous Cu Nanoparticle Ink and Adhesion of Printed Cu Pattern on Polyimid Film
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  • Journal title : Korean Journal of Materials Research
  • Volume 25, Issue 12,  2015, pp.719-726
  • Publisher : The Materials Research Society of Korea
  • DOI : 10.3740/MRSK.2015.25.12.719
 Title & Authors
Effects of Poly(Styrene-Co-Maleic acid) as Adhesion Promoter on Rheology of Aqueous Cu Nanoparticle Ink and Adhesion of Printed Cu Pattern on Polyimid Film
Jo, Yejin; Seo, Yeong-Hui; Jeong, Sunho; Choi, Youngmin; Kim, Eui Duk; Oh, Seok Heon; Ryu, Beyong-Hwan;
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For a decade, solution-processed functional materials and various printing technologies have attracted increasingly the significant interest in realizing low-cost flexible electronics. In this study, Cu nanoparticles are synthesized via the chemical reduction of Cu ions under inert atmosphere. To prevent interparticle agglomeration and surface oxidation, oleic acid is incorporated as a surface capping molecule and hydrazine is used as a reducing agent. To endow water-compatibility, the surface of synthesized Cu nanoparticles is modified by a mixture of carboxyl-terminated anionic polyelectrolyte and polyoxylethylene oleylamine ether. For reducing the surface tension and the evaporation rate of aqueous Cu nanoparticle inks, the solvent composition of Cu nanoparticle ink is designed as DI water:2-methoxy ethanol:glycerol:ethylene glycol = 50:20:5:25 wt%. The effects of poly(styrene-co-maleic acid) as an adhesion promoter(AP) on rheology of aqueous Cu nanoparticle inks and adhesion of Cu pattern printed on polyimid films are investigated. The 40 wt% aqueous Cu nanoparticle inks with 0.5 wt% of Poly(styrene-co-maleic acid) show the "Newtonian flow" and has a low viscosity under , which is applicable to inkjet printing. The Cu patterns with a linewidth of are successfully fabricated. With the addition of Poly(styrene-co-maleic acid), the adhesion of printed Cu patterns on polyimid films is superior to those of patterns prepared from Poly(styrene-co-maleic acid)-free inks. The resistivities of Cu films are measured to be at annealing temperature of .
aqueous Cu nanoparticle ink;inkjet printing;poly(styrene-co-maleic acid);rheology;adhesion of printed Cu pattern;
 Cited by
S. Jeong, H. Song, W. Lee, S. Lee, Y. Choi, W. Son, E. Kim, C. Paik, S. Oh, and B. Ryu, Langmuir, 27, 3144 (2011). crossref(new window)

Y. Choi and S. Hong, Langmuir, 31, 8101 (2015). crossref(new window)

G. L. Draper, R. Dharmadasa, M. E. Staats, B. W. Lavery and T. Druffel, ACS Appl. Mater. Interfaces, 7, 16478 (2015). crossref(new window)

J. Park, G. Kang, H. Ahn and L. Guo, J. Adv. Mater., 22, E247 (2010). crossref(new window)

Y. Li, Y. Wu and B. Ong, J. Am. Chem. Soc., 127, 3266 (2005). crossref(new window)

H. Sirringhaus, T. Kawase, R. H. Friend, T. Shimoda, M. Inbasekaran, W. Wu and P. Woo, Science, 290, 2123 (2000). crossref(new window)

R. K. Holman, S. A. Uhland, M. Cima and J. E. Sachs, J. Colloid Interface Sci., 247, 266 (2002). crossref(new window)

P. Chantal, J. Robert, K. Arnold, M. Olga, F. Julie, L. Sylvie and M. Patrick. Org. Electron., 15, 1836 (2014). crossref(new window)

P. Buffat and J. P. Borel, Phys. Rev. A: At. Mol. Opt. Phys., 13, 2287 (1976). crossref(new window)

S. Jeong, K. Woo, D. Kim, S. Lim, J. S. Kim, H. Shin, Y. Xia and J. Moon, Adv. Funct. Mater., 18, 679 (2008). crossref(new window)

S. Gamerith, A. Klug, H. Scheiber, U. Scherf, E. Moderegger and E. J. List, Adv. Funct. Mater., 17, 3111 (2007). crossref(new window)

K. Woo, D. Kim, J. S. Kim, S. Lim and J. Moon, Langmuir, 25, 429 (2009). crossref(new window)

B. J. Gans, ; U. S. Schubert, Langmuir, 20, 7789 (2004). crossref(new window)

D. Soltman and V. Subramanian, Langmuir, 24, 2224 (2008). crossref(new window)

R. Prucek, L. Kvitek, A. Panacek, L. Vancurova, J. Soukupova, D. Jancik and R. J. Zboril, Mater. Chem., 19, 8463 (2009). crossref(new window)

B. Escaig, J. de Physique IV, 03(C7), C7-753 (1993).

J. D. Venables, J. Mater. Sci., 19, 2431 (1984). crossref(new window)

G. Ramarathnam, M. Libertucci, M. M. Sadowski and T. H. North, Weld. Res. Suppl., 12, 483S (1992).