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Taper phenomenon of UV-laser punching process on zero-shrinkage substrate
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 Title & Authors
Taper phenomenon of UV-laser punching process on zero-shrinkage substrate
Ahn, Ik-Jun; Yeo, Dong-Hun; Shin, Hyo-Soon; Shim, Kwang Bo;
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 Abstract
With the miniaturization with both high functionality and high integrity of the probe cards, the highly precise laser punching on the zero-shrinkage high strength substrate has attracted more attention recently. Taper occurrence during laser-punching on green sheets appears as a problem in process. The size (diameter) difference between the entrance hole and the exit hole in tapered holes appeared to be inversely proportional to the hole size itself. To suppress taper occurrence, two-stage punching was adopted as the size of second hole was varied from to when punching via holes on the substrate with thickness of . The minimal taper ratio of 11.9 % appeared with second hole size between 70 to before sintering. Taper ratio reduced to 7 % after zero-shrinkage sintering. The size difference between first hole and second hole appeared minimal when the size of second hole was 95~97 % to that of first hole.
 Keywords
UV-Laser;Taper;First hole;Second hole;Zero-shrinkage;
 Language
Korean
 Cited by
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