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Analysis and Visualization of Temperature Field for Wafer Batch in Furnace
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 Title & Authors
Analysis and Visualization of Temperature Field for Wafer Batch in Furnace
Kang, Seung-Hwan; Lee, Seung Ho; Kim, Byeong Hoon; Ko, Han Seo;
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The temperature of the wafer batch in the furnace was calculated and its visualized temperature field was analyzed. The main heat transfer mechanisms from the heater wall to the wafers were radiation and conduction, and the finite difference method was used to analyze the complex heat transfer including those two mechanisms. The visualized temperature field shows that the direction of the heat flux in the wafer batch varies during the heating process, and the heat in the wafer batch diffuses faster by conduction within the wafer than by radiation between the wafers, in the condition of the constant temperature at the heater wall and cap.
Wafer Temperature;Radiation Heat Transfer;Finite Difference Method;
 Cited by
두께 균일도 향상을 위한 LPCVD 챔버 내 웨이퍼 온도 분포 분석,강승환;김병훈;공병환;이재원;고한서;

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