A Review on Thermal Conductivity of Polymer Composites Using Carbon-Based Fillers : Carbon Nanotubes and Carbon Fibers Hong, Jin-Ho; Park, Dong-Wha; Shim, Sang-Eun;
Recently, the use of thermal conductive polymeric composites is growing up, where the polymers filled with the thermally conductive fillers effectively dissipate heat generated from electronic components. Therefore, the management of heat is directly related to the lifetime of electronic devices. For the purpose of the improvement of thermal conductivity of composites, fillers with excellent thermally conductive behavior are commonly used. Thermally conductive particles filled polymer composites have advantages due to their easy processibility, low cost, and durability to the corrosion. Especially, carbon-based 1-dimensional nanomaterials such as carbon nanotube (CNT) and carbon nanofiber (CNF) have gained much attention for their excellent thermal conductivity, corrosion resistance and low thermal expansion coefficient than the metals. This paper aims to review the research trends in the improvement of thermal conductivity of the carbon-based materials filled polymer composites.
Preparation and characterization of carbon fiber-reinforced thermosetting composites: a review, Carbon letters, 2015, 16, 2, 67
Anisotropic thermal conductivity of polypropylene composites filled with carbon fibers and multiwall carbon nanotubes, Polymer Composites, 2015, 36, 11, 1951
A review of the preparation and properties of carbon nanotubes-reinforced polymer compositess, Carbon letters, 2011, 12, 2, 57
Review of polymers for heat exchanger applications: Factors concerning thermal conductivity, Applied Thermal Engineering, 2017, 113, 1118
Comparative Review on Structure, Properties, Fabrication Techniques, and Relevance of Polymer Nanocomposites Reinforced with Carbon Nanotube and Graphite Fillers, Polymer-Plastics Technology and Engineering, 2016, 55, 2, 171
Synthesis of nano-scale coated manganese oxide on graphite nanofibers and their high electrochemical performance, Synthetic Metals, 2011, 161, 17-18, 1966
Chung, D. D. L. Appl. Therm. Eng. 2001, 21, 1593.
Tritt, T. M. "Thermal Conductivity: Theory, Properties, and Applications", Springer Science, New York, 2004.
Sanada, K.; Tada Y.; Shindo, Y. Compos. Part A-Appl. S. 2009, 40, 724.
Prasher, R. Proceedings of the IEEE, 2006, 94, 1571.
Gwinn, J. P.; Webb, R. L. Microelectron. J. 2003, 34, 215.
Finan, J. M. Proceedings of Society of Plastic Engineers' Annual Technical Conference, 1999, 1547.
Heiser, J. A.; King, J. A. Polym. Composite 2004, 25, 186.
Sim, L. C.; Ramanan, S. R.; Ismail, H.; Seetharamu, K. N.; Goh, T. J. Thermochim. Acta 2005, 430, 155.
Zhou, W.; Qi, S.; Tu, C.; Zhao, H.; Wang, C.; Kou, J. J. Appl. Polym. Sci. 2007, 104, 1312.
Kim, S. H.; Choi, S. R.; Kim, D. J. Heat Trans.-T. ASME 2007, 129, 298.
Zhou, W.; Qi, S.; An, Q.; Zhao, H.; Liu, N. Mater. Res. Bull. 2007, 42, 1863.