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Cross-flow Nanofiltration of PCB Etching Waste Solution Containing Copper Ion
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  • Journal title : Korean Chemical Engineering Research
  • Volume 52, Issue 2,  2014, pp.272-277
  • Publisher : The Korean Institute of Chemical Engineers
  • DOI : 10.9713/kcer.2014.52.2.272
 Title & Authors
Cross-flow Nanofiltration of PCB Etching Waste Solution Containing Copper Ion
Park, Hye-Ri; Nam, Sang-Won; Youm, Kyung-Ho;
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In this study the nanofiltration (NF) membrane treatment of a sulfuric acid waste solutions containing copper ion () discharging from the etching processes of the printed circuit board (PCB) manufacturing industry has been studied for the recycling of acid etching solution. SelRO MPS-34 4040 NF membrane from Koch company was tested to obtain the basic NF data for recycling of etching solution and separation efficiency (total rejection) of copper ion. NF experiments were carried out with a cross-flow membrane filtration laboratory system. The permeate flux was decreased with the increasing copper ion concentration in sulfuric acid solution and lowering pH of acid solution, and its value was the range of . Total rejection of copper ion was decreased with the increasing copper ion concentration, lowering pH of acid solution and decreasing cross-flow rate. The total rejection of copper ion was more than 70% at the experimental condition. The SelRO MPS-34 4040 NF membrane was represented the stable flux and rejection for 1 year operation.
Nanofiltration;PCB(Printed Circuit Board);Etching Solution;Recycle of Etching Solution;Copper Ion;
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