JOURNAL BROWSE
Search
Advanced SearchSearch Tips
Interfacial Characteristics of Al/Cu Hybrid Materials Prepared by Compound Casting
facebook(new window)  Pirnt(new window) E-mail(new window) Excel Download
  • Journal title : Journal of Korea Foundry Society
  • Volume 35, Issue 6,  2015, pp.141-146
  • Publisher : The Korean Foundrymens Society
  • DOI : 10.7777/jkfs.2015.35.6.141
 Title & Authors
Interfacial Characteristics of Al/Cu Hybrid Materials Prepared by Compound Casting
Kim, Nam-Hoon; Kim, Jeong-Min;
  PDF(new window)
 Abstract
Aluminum-based hybrid parts were fabricated through a compound casting process with Al or Cu inserts which can be used for applications requiring high conductivity. Because the interface stability between the insert and the aluminum matrix is important, the effects of process variables on the interfacial adhesion strength were investigated. Additions of Cu and Mg to Al melt were found to enhance the adhesion strength, though the melt fluidity was slightly deteriorated when a small amount of Mg was added. An isothermal heating process after casting further improved the strength. However AlCu intermetallic compounds formed and their thickness increased during the heating process. As a result, deterioration in the interfacial adhesion strength was observed after an excessive annealing treatment.
 Keywords
Aluminum;Compound casting;Conductivity;Adhesion strength;Fluidity;
 Language
Korean
 Cited by
1.
알루미늄의 전기 및 열전도도에 미치는 Boron의 영향,박민경;조재익;이성희;김철우;

한국주조공학회지, 2016. vol.36. 5, pp.147-152 crossref(new window)
1.
Effect of Boron on Electrical and Thermal Conductivities of Aluminum, Journal of Korea Foundry Society, 2016, 36, 5, 147  crossref(new windwow)
 References
1.
F. Cardarelli, 'Materials Handbook', Springer (2000) 45-57.

2.
V.Y. Mehr, M.R. Toroghinejad and A. Rezaejan, Mater. Sci. Eng. A, "Mechanical properties and microstructure evolutions of multilayered Al-Cu composites produced by accumulative roll bonding process and subsequent annealing", 601 (2014) 40-47. crossref(new window)

3.
Kim IK and Hong SI, Mater. Design, "Effect of heat treatment on the bending behavior of tri-layered Cu/Al/Cu composite plates", 47 (2013) 590-598. crossref(new window)

4.
E. Hajjari, M. Divandari, S.H. Razavi, T. Homma and S. Kamado, Intermetallics, "Intermetallic compounds and antiphase domains in Al/Mg compound casting", 23 (2012) 182-186. crossref(new window)

5.
M. Divandari and A.R. Vahid Golpayegani, Mater. Design, "Study on Al/Cu rich phases formed in A356 alloy by inserting Cu wire in pattern in LFC process", 30 (2009) 3279-3285. crossref(new window)

6.
K.J.M. Papis, B. Hallstedt, J.F. Loffler and P.J. Uggowitzer, Acta Mater., "Interface formation in aluminium-aluminium compound casting", 56 (2008) 3036-3043. crossref(new window)

7.
S.S.M. Kartheek, K.V. Vamsi, B. Ravisankar, K. Sivaprasad and S. Karthikeyan, Procedia Mater. Sci., "Microstructural and nanoindentation studies across diffusion-bonded interfaces in Al/Cu metal intermetallic laminates", 6 (2014) 709-715. crossref(new window)

8.
Lee KS and Kwon YN, Trans. Nonferrous Met. Soc. China, "Solid-state bonding between Al and Cu vacuum hot pressing", 23 (2013) 341-346. crossref(new window)

9.
Kwon YD and Lee ZH, Mater. Sci. Eng. A, "The effect of grain refining and oxide inclusion on the fluidity of Al-4.5Cu- 0.6Mn and A356 alloys", 360 (2003) 372-376. crossref(new window)

10.
A. Heidarzadeh, M. Emamy, A. Rahimzadeh, R. Soufi, D. Sohrabi Baba Heidary and Sh. Naibi, J. Mater. Eng. Performance, "The effect of copper addition on the fluidity and viscosity of an Al-Mg-Si alloy", 23 (2014) 469-476. crossref(new window)

11.
W. Prukkanon, N. Srisukhumbowornchai and C. Limmaneevichitr, J. Alloys Compd., "Influence of Sc modification on the fluidity of an A356 aluminum alloy", 487 (2009) 453-457. crossref(new window)

12.
K.R. Ravi, R.M. Pillai, K.R. Amaranathan, B.C. Pai, and M. Chakraborty, J. Alloys Compounds, "Fluidity of aluminum alloys and composites, a review", 456 (2008) 201-210. crossref(new window)

13.
O. Dezellus, M. Zhe, F. Bosselet, D. Rouby and J.C. Viala, Mater. Sci. Eng. A, "Mechanical testing of titanium/aluminiumsilicon interface: Effect of T6 heat treatment", 528 (2011) 2795-2803. crossref(new window)

14.
O. Dezellus, L. Milani, F. Bosselet, M. Sacerdote-Peronnet, D. Rouby and J.C. Viala, J. Mater. Sci., "Mechanical testing of titanium/aluminium- silicon interfaces by push-out", 43 (2008) 1749-1756. crossref(new window)

15.
B.A. Huchler: Ph.D. Thesis, Univ. Birmingham, UK, "Pressure infiltration behaviour and properties of aluminium alloy - oxide ceramic preform composites", (2009).

16.
Y. Tanaka, M. Kajihara and Y. Watanabe, Mater. Sci. Eng. A, "Growth behavior of compound layers during reactive diffusion between solid Cu and liquid Al", 445-446 (2007) 355-363. crossref(new window)

17.
Kim HJ, Lee JY, Paik KW, Koh KW, Won JH, Choe SH, Lee J, Moon JT and Park YJ, IEEE Trans. Comp. Packag. Technol., "Effect of Cu/Al intermetallic compound on copper wire and aluminum pad bondability", 26 (2003) 367-374. crossref(new window)