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Carbon Dioxide Sensor Substrate for Surface-mounted Packaging
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 Title & Authors
Carbon Dioxide Sensor Substrate for Surface-mounted Packaging
Han, Hyeuk-Jin; Kim, Tae Wan; Park, Kwang-Min; Park, Chong-Ook;
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 Abstract
Solid state electrochemical and chemo-resistive gas sensors have been used widely but can operate only under high temperature. For reducing the power consumption and optimizing the structure of the substrate of these sensors, we conducted device and circuit simulations using the COMSOL Multiphysics simulator. For assessing the effective types of substrate and heat isolation, we conducted three-dimensional thermal simulations in two separate parts; (a) by changing the shape of the contacting holes and (b) punching additional holes on the substrate. Thus, it was possible to achieve high temperature in the sensor end of the substrate while maintaining low power consumption, and temperature in the circuit.
 Keywords
Simulation;Sensor substrate;Heat transfer effect;
 Language
English
 Cited by
1.
Comparison of the Power Consumption between the Ceramic and Wire Bonding Packaging Methods for Solid State Electrochemical Carbon dioxide Sensors, Journal of Sensor Science and Technology, 2016, 25, 3, 173  crossref(new windwow)
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