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Comparison of the Power Consumption between the Ceramic and Wire Bonding Packaging Methods for Solid State Electrochemical Carbon dioxide Sensors
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 Title & Authors
Comparison of the Power Consumption between the Ceramic and Wire Bonding Packaging Methods for Solid State Electrochemical Carbon dioxide Sensors
Kim, Tae Wan; Park, Chong-Ook;
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 Abstract
Tape casting ceramics technology has been adopted for the fabrication of solid state electrochemical sensors and the packaging substrates. The fabricated sensors exhibit a fast response and a good recovery with the almost theoretical sensitivity of 37 mV/decade, corresponding to a sensor operating temperature of 373 K. The two packaging methods, the wire bonding package and the surface- mounted on the ceramic package, were compared with respect to their power consumption and mass production feasibility. In terms of the ease of fabrication, the surface mount packaging technology is superior to the wire bonding technology but its power consumption is approximately twice that of the wired package.
 Keywords
sensor;Packaging;Gas sensor;Sensitivity;Power consumption;
 Language
English
 Cited by
 References
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