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Application of Surfactant added DHF to Post Oxide CMP Cleaning Process
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 Title & Authors
Application of Surfactant added DHF to Post Oxide CMP Cleaning Process
Ryu, Chung; Kim, You-Hyuk;
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 Abstract
In order to remove particles on surface of post-oxide CMP wafer, new cleaning solution was prepared by mixing with DHF (Diluted HF), nonionic surfactant PAAE (Polyoxyethylene Alkyl Aryl Ether), DMSO (Dimethylsulfoxide) and D.I.W.. Silicone wafers were intentionally contaminated by silica, alumina and PSL (polystylene latex) which had different zeta potentials in cleaning solution. This cleaning solution under megasonic irradiation could remove particles and metals simultaneously at room temperature in contrast to traditional AMP (mixture of and D.I.W) without any side effects such as increasing of microroughness, metal line corrosion and deposition of organic contaminants. This suggests that this cleaning solution would be useful future application with copper CMP in brush cleaning process as well as traditional post CMP cleaning process.礂댐𡦖⨀ꇅȀ‷ᔂ–ꞚĀĀĀĀ Ѐ̀ 밟ꘂĀ
 Keywords
Post-oxide CMP;Surfactant;Cleaning Solution;
 Language
Korean
 Cited by
 References
1.
Zhang, F; Busnaina, A.A. J. Appl. Phys. A. 1999, 69, 437. crossref(new window)

2.
Zhang, F; Busnaina, A.A.; Ahmadi, G. J. Electrochem. Soc. 1999, 146.

3.
Busnaina, A.A.; Elsawy, T.M. J. Electron. Mater. 1998, 27, 1095. crossref(new window)

4.
Busnaina, A.A.; Moumen, N. In Semiconductor Fabtech; 12th Ed., 2000, 293.

5.
Itano, M.; Kezuka, T.; Ishii, M.; Unemoto, T.; Kudo, M.; Ohmi, T. J. Electrochem. Soc. 1995, 142.

6.
Kikuyama, H.; Miki, N.;Saka, K.; Takano, J.; Kawanabe, I.; Miyashita, M.; Ohmi, T. IEEE Trans. Semicond. 1990, 99.

7.
Ramachandran, S.; Busnaina, A.; Small, R.; Shang, C.; Chen, Z. In Semiconductor Fabtech; 15th Ed, 2001, 153.

8.
Ramachandran, S.; Busnaina, A.; Small, R.; Shang, C.; Chen, Z. In Semiconductor Fabtech; 13th Ed., 2001, 271.

9.
Paillet, C. et al. In ECS, Chicago, 1996, Abstract No. 481.

10.
Kern, W. et al. RCA Review. 1970, 187.

11.
Kikyuama, H.;Miki, N.;Saka, K.; Takano, J.; Kawanabe, I.; Miyashita, M.;Ohmi, T. IEEE Trans. Semicond., 1991, 315, 4.