Publisher : The Korean Institute of Electrical and Electronic Material Engineers
DOI : 10.4313/JKEM.2016.29.2.125
Title & Authors
Thermal Analysis for Improvement of Heat Dissipation Performance of the Rail Anchoring Failure Detection Module Chae, Won kyu; Park, Young; Kwan, Sam young; Lee, Jaehyeong;
In this paper, various heat dissipation designs for a rail anchoring failure detection module were investigated by a thermal flow analysis. For the detection module with the heat dissipation design on the overall housing surface, an average temperature inside the module was lowered by when compared to no heat dissipation design. In addition, an internal heat-flow blocking layer and an heat conduction layer inserted between the LED module and housing case were effective in reducing the temperature in the rail anchoring failure detection, which has a limited space for installation and little air flow. Especially, the temperature near LED module decreased below when the optimal heat dissipation design was applied.