Thermal Analysis for Improvement of Heat Dissipation Performance of the Rail Anchoring Failure Detection Module

Title & Authors
Thermal Analysis for Improvement of Heat Dissipation Performance of the Rail Anchoring Failure Detection Module
Chae, Won kyu; Park, Young; Kwan, Sam young; Lee, Jaehyeong;

Abstract
In this paper, various heat dissipation designs for a rail anchoring failure detection module were investigated by a thermal flow analysis. For the detection module with the heat dissipation design on the overall housing surface, an average temperature inside the module was lowered by $\small{25^{\circ}C}$ when compared to no heat dissipation design. In addition, an internal heat-flow blocking layer and an heat conduction layer inserted between the LED module and housing case were effective in reducing the temperature in the rail anchoring failure detection, which has a limited space for installation and little air flow. Especially, the temperature near LED module decreased below $\small{55^{\circ}C}$ when the optimal heat dissipation design was applied.
Keywords
Rail anchoring measurement module;Heat flow simulation;Heat dissipation design;Heat conduction;
Language
Korean
Cited by
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