A Study on the Metal Mesh for CuNx-Cu-CuNx Multi-layer Touch Electrode by Reactive Magnetron Sputtering

Title & Authors
A Study on the Metal Mesh for CuNx-Cu-CuNx Multi-layer Touch Electrode by Reactive Magnetron Sputtering
Kim, Hyun-Seok; Yang, Seong-Ju; Noh, Kyeong-Jae; Lee, Seong-Eui;

Abstract
In the present study, the $\small{CuN_x-Cu-CuN_x}$ layer the partial pressure ratio Cu metal of Ar and $\small{N_2}$ gas using a DC magnetron sputtering device, was generated by the In-situ method. $\small{CuN_x}$ layer was able to obtain a surface reflectance reduction effect from the advantages of the process and the external light. $\small{CuN_x}$ layer is gas partial pressure, DC the Power, the deposition time variable transmittance in response to the thickness and partial pressure ratio, the reflectance was measured. $\small{Ar:N_2}$ gas ratio 10:10(sccm), DC power 0.35 A, was derived Deposition time 90 sec optimum conditions. Thus, according to the optimal thickness and the composition ratio was derived surface reflectance of 20.75%. In addition, to derive the value of $\small{{\Delta}}$ Ra surface roughness of 0.467. It was derived $\small{CuN_x}$ band-gap energy of about 2.2 eV. Thus, to ensure a thickness and process conditions can be absorbed to maximize the light in a wavelength band in the visible light region. As a result, the implementation of the $\small{12k{\Omega}}$ base line resistance of using the Cu metal. This is, 5 inch Metal mesh TSP(L/S: $\small{4/270{\mu}m}$) is in the range of the reference operation.
Keywords
ITO;Metal mesh;Starburst;Reflectance;Absorptance;Band-gap;
Language
Korean
Cited by
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