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Inspection method of BGA Ball Using 5-step Ring Illumination
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 Title & Authors
Inspection method of BGA Ball Using 5-step Ring Illumination
Kim, Jong Hyeong; Nguyen, Chanh D.Tr.;
 
 Abstract
Fast inspection of solder ball bumps in ball grid array (BGA) is an important issue in the flip chip bonding technology. Particularly, semiconductor industry has required faster and more accurate inspection of micron-size solder bumps in flip chip bonding, as the density of balls increase dramatically. In this paper, we describe an inspection approach of BGA balls by using 5-step ring illumination device and normalized cross-correlation (NCC) method. The images of BGA ball by the illumination device show unique and distinguishable characteristic contours by their 3-D shapes, which are called as "iso-slope contours". Template images of reference ball samples can be produced artificially by the hybrid reflectance model and 3D data of balls. NCC values between test and template samples are very robust and reliable under well-structured condition. The 200 samples on real wafer are tested and show good practical feasibility of the proposed method.
 Keywords
BGA balls;Specular reflection;5-step ring illumination;iso-slope contour;hybrid reflectance model;
 Language
Korean
 Cited by
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