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3D Measurement System of Wire for Automatic Pull Test of Wire Bonding
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 Title & Authors
3D Measurement System of Wire for Automatic Pull Test of Wire Bonding
Ko, Kuk Won; Kim, Dong Hyun; Lee, Jiyeon; Lee, Sangjoon;
 
 Abstract
The bond pull test is the most widely used technique for the evaluation and control of wire bond quality. The wire being tested is pulled upward until the wire or bond to the die or substrate breaks. The inspector test strength of wire by manually and it takes around 3 minutes to perform the test. In this paper, we develop a 3D vision system to measure 3D position of wire. It gives 3D position data of wire to move a hook into wires. The 3D measurement method to use here is a confocal imaging system. The conventional confocal imaging system is a spot scanning method which has a high resolution and good illumination efficiency. However, a conventional confocal systems has a disadvantage to perform XY axis scanning in order to achieve 3D data in given FOV (Field of View) through spot scanning. We propose a method to improve a parallel mode confocal system using a micro-lens and pin-hole array to remove XY scan. 2D imaging system can detect 2D location of wire and it can reduce time to measure 3D position of wire. In the experimental results, the proposed system can measure 3D position of wire with reasonable accuracy.
 Keywords
wire bonding pull tester;MLA (Multi Lens Array);parallel confocal microscopy;3D measurement;
 Language
Korean
 Cited by
 References
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