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3-Dimensional Shape Measurement System for BGA Balls Using PMP Method
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 Title & Authors
3-Dimensional Shape Measurement System for BGA Balls Using PMP Method
Kim, Hyo Jun; Kim, Joon Seek; Joo, Hyonam;
As modern electronic devices get smaller and smaller, high-resolution, large Field-Of-View (FOV), fast, and cost-effective 3-dimensional (3-D) measurement is requested more and more. In particular, defect inspection machines using machine-vision technology nowadays require 3-D inspection as well as the conventional 2-D inspection. Phase Measuring Profilometry (PMP) is one of the fast non-contact 3-D shape measuring methods currently being extensively investigated in the electronic component manufacturing industry. The PMP system is well known and is successfully applied to measuring complex surface profiles with varying reflectance properties. However, for highly reflective surfaces, such as Ball Grid Arrays (BGAs), it has difficulty accurately measuring 3-D shapes. In this paper, we propose a new fast optical system that can eliminate the highly reflective saturated regions in BGA ball images. This is achieved by utilizing four Low Intensity Grating (LIG) images together with the conventional High Intensity Grating (HIG) images. Extensive experiments using BGA samples show a repeatability of under in standard deviation, which is suitable for most 3-D shape measurements of BGAs.
PMP;3-dimensional measurement;BGA ball;non-contact measurement;
 Cited by
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