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A NUMERICAL STUDY ON THERMAL DESIGN OF A LARGE-AREA HOT PLATE FOR THERMAL NANOIMPRINT LITHOGRAPHY
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 Title & Authors
A NUMERICAL STUDY ON THERMAL DESIGN OF A LARGE-AREA HOT PLATE FOR THERMAL NANOIMPRINT LITHOGRAPHY
Park, G.J.; Lee, J.J.; Kwak, H.S.;
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 Abstract
A numerical study is conducted on thermal performance of a large-area hot plate specially designed as a heating and cooling tool for thermal nanoimprint lithography process. The hot plate has a dimension of , in which a series of cartridge heaters and cooling holes are installed. The material is stainless steel selected for enduring the high molding pressure. A numerical model based on the ANSYS Fluent is employed to predict the thermal behavior of the hot plate both in heating and cooling phases. The PID thermal control of the device is modeled by adding user defined functions. The results of numerical computation demonstrate that the use of cartridge heaters provides sufficient heat-up performance and the active liquid cooling in the cooling holes provides the required cool-down performance. However, a crucial technical issue is raised that the proposed design poses a large temperature non-uniformity in the steady heating phase and in the transient cooling phase. As a remedy, a new hot plate in which heat pipes are installed in the cooling holes is considered. The numerical results show that the installation of heat pipes could enhance the temperature uniformity both in the heating and cooling phases.
 Keywords
Hot Plate;Thermal Design;Rapid Heating and Cooling;Temperature Uniformity;Thermal Diffusivity;Thermal Nanoimprint Lithography;Heat Pipes;
 Language
Korean
 Cited by
 References
1.
2003, Gary, S.M. and Simon, M.S., Fundamentals of Semiconductor Fabrication, John Wily & Sons, New York.

2.
1996, Chou, S.Y., Krauss, P.R. and Renstrom, P.J., "Nanoimprint Lithography," J. Vac. Sci. Technol., Vol.14, No.6, pp.4129-4133. crossref(new window)

3.
2000, Becker, H. and Heim, U., "Hot Embossing as a Method for the Fabrication of Polymer High Aspect Ratio Structures," Sensors and Actuators A, Physical, Vol.84, pp.130-135.

4.
1998, Pang, S.W., Tamamura, T., Nakao, M., Ozawa, A. and Masuda, H., "Direct Nano-Printing on Al Substrate Using a SiC Mold," J. Vac. Sci. Technol., Vol.16, pp.1145-1149.

5.
2001, Hirai, Y., Fujiwara, M., Okuno, T., Tanaka, Y., Endo, M., Irie, S., Nakagawa, K. and Sasago, M., "Study of the Resist Deformation in Nanoimprint Lithography," J. Vac. Sci. Technol., Vol.19, pp.2811-2815. crossref(new window)

6.
2002, Beck, M., Graczyk, M., Maximov, I., Sarwe, E.L., Ling, T.G.I., Keil, M. and Motelius, L., "Improving Stamps for 10 nm Level Wafer Scale Nanoimprint Lithography," Microelectron. Eng., Vol.61-2, pp.441-448. crossref(new window)

7.
2004, Khang, D.Y., Kang, H., Kim, T. and Lee, H.H., "Low-Pressure Nanoimprint Lithography," Nano Lett., Vol.4, pp.633-637. crossref(new window)

8.
2006, Kwak, H.S., Park, G.J., Son, B.C., Lee, J.J. and Park, H.C., "Design of a Hot plate with Rapid Cooling Capability for Thermal Nanoimprint Lithography," Proc. SICE-ICASE Int. Joint Conf., Busan, pp.4897-4901.

9.
2007, Park, G.J., Kwak, H.S., Shin, D.W. and Lee, J.J. "Numerical Simulation of Thermal Control of a Hot Plate for Thermal Nanoimprint Lithography Machines," Proc. 3rd Int. Conf. on Heating Cooling Technol., pp.321-327.

10.
2008, Yang, J.H., "An Experimental Study on the Thermal Performance of a Hot Plate for Thermal Nanoimprint Lithography," Master Thesis, Kumoh National Institute of Technology.

11.
1995, Faghri, A., Heatpipe Science and Technology, Taylor & Francis.

12.
2012, Wallin, P., "Heat Pipe, selection of working fluid," Heat and Mass Trasfer Project Report, MVK160, pp.1-7.

13.
2012, Y.A. Cengel, Heat and Mass transfer, McGraw-Hill, Chapter 9, pp.521-527.