Thermal Characteristics of a Heat Sink with Helical Fin Structure for an LED Lighting Fixture Kim, Young-Hoon; Yim, Hae-Dong; O, Beom-Hoan;
In this paper, we design a helical fin structure for the heat sink for a high-power LED lighting module, and analyze its thermal properties. By means of the helical fin structure, we can obtain about 14% larger surface area for the limited volume and it can decrease the LED chip temperature by about 12%. Because this helical fin heat sink has 15% less total volume than a conventional one, we can also expect to reduce the production cost due to these structural properties.
LED;Thermal characteristics;Heat sink;Helical Fin structure;
Y. J. Kim, S. Kim, and G. Cho, "A study on heat radiation and luminous flux in led lamp," in Proc. The Korean Institute of Illuminating and Electrical Installation Engineers Autumn Meeting (Nov. 2011), pp. 109-112.
S.-Y. Yang and C.-W. Yi, "A study on reliability analysis for reliability testing & field degradation data of LED lighting," Journal of KIIEE 25, 54-59 (2011).
C. Biber, "LED light emission as a function of thermal conditions," Semiconductor Thermal Measurement and Management Symposium, Semi-Therm 2008, Twenty-fourth Annual IEEE, 180-184 (2008)
S. Chhajed, Y. Xi, Yh. Gessmann, J.-Q. Xi, J. M. Shah, J. K. Kim, and E. F. Schubert, "Junction temperature in light-emitting diodes assessed by different methods," Proc. SPIE 5739, Manufacturing, and Applications IX, 16 (2005).
ARPACI, KAO, SELAMET, Introduction to Heat Transfer (Prentice Hall, 2000), p. 91.
D. D. L. Chung, "Materials for thermal conduction," Applied Thermal Engineering 21, 1593-1605 (2001).