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Lead-free Solder Technology and Reliability for Automotive Electronics
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 Title & Authors
Lead-free Solder Technology and Reliability for Automotive Electronics
Lee, Soon-Jae; Jung, Jae-Pil;
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 Abstract
In this study, properties of Pb-free solders for automotive electronics parts were discussed. Lead-free solders for electronics became important after RoHS (Restriction of the use of certain Hazardous Substances) to avoid environmental pollution. Also the growing electronic rate in automotive parts and ELV (End-of Life Vehicles) make Pb-free solder for automotive electronics to be inevitable trend. Definitely, Pb-free solder for automotive electronics should have good wettability, basic strength, but need more reliability than other solders, since it has harsh condition like high temperature, humidity and engine vibration. Thus, shear strength test, thermal shock, drop test and many others are needed to ensure the high reliability. This study describes the properties and requirements of Pb-free solders for automotive electronics.
 Keywords
automotive electronics;Pb-free solder;ELV;reliability;
 Language
Korean
 Cited by
 References
1.
Y. H. Ko, S. H. Yoo and C. W. Lee, "Evaluation on Reliability of High Temperature Lead-free Solder for Automotive Electronics", J. Microelectron. Packag. Soc., 17(4), 35 (2010).

2.
S. I. Son, Y. E. Shin and Y. J. Jeon, "A Study on Tensile Characteristic of QFP Lead-free Joint for Automotive Electrical Parts", KSPE, 1103-110 (2010).

3.
Electronics in automotive form http://www.spidconsulting.com/index.php/user/common/menu_link/2

4.
B. I. Noh, J. W. Yoon, Bui Quoc Vu and S. B. Jung, "Study on Wettability of Sn-Xwt%Cu Solder", Journal of KWJS, 25(6), 12 (2007).

5.
KRUSS, "Drop Shape Analysis", http://www.kruss.de/services/education-theory/glossary/drop-shape-analysis/.

6.
SEI Electronics Inc., Reliability Testing Procedures, http://www.twinstar-tech.com/product_sei/SingleLayerApplication.pdf.

7.
JFE Techno-Research Corporation, "Solder wettability test", http://www.jfe-tec.co.jp/en/electronic-component/case/case03.html.

8.
http://www.mtarr.co.uk/courses/topics/0149_stst/index.html.

9.
D. H. Jung, W. G. Lee and J. P. Jung, "Effect of Shearing Speed and UBMs on High Speed Shear Properties of Sn3.0Ag0.5Cu Solder Ball", J. Met. Mater., 49(8), 1 (2011). crossref(new window)

10.
JESD22-B117A, JEDEC Solid State Tech. Association (2006).

11.
C. H. Yu and K. S. Kim, "Thermal Cycling Analysis of Flip- Chip BGA Solder Joints", J. Microelectron. Packag. Soc., 10(1), 45 (2003).

12.
Y. G. Lee, H. Y. Lee, J. T. Moon, J. H. Park, S. S. Han and J. P. Jung, "Characteristics of the High Speed Shear Test for sn-3.0wt.%Ag-0.5wt.%Cu Solder Ball Joints", J. Kor. Inst. Met. & Mater., 47(9), 580 (2009).

13.
Santosh Kumar, J. Y. Park and J. P. Jung, "Analysis of high speed shear characteristics of Sn-Ag-Cu solder joints", Electronic Materials Letters, 7(4), 365 (2011). crossref(new window)

14.
D. H. Jung, Y. G. Lee and J. P. Jung, "Shearing Characteristics of Sn3.0Ag0.5Cu Solder Ball for Standardization of High Speed Shear Test", J. Microelectron. Packag. Soc., 18(1), 35 (2011).

15.
W. G. Lee and J. P. Jung, "Effect of Shearing Speed on High Speed shear Properties of Sn1.0Ag0.5Cu Solder Bump on Various UBM's", Kor. J. Met. Mater., 49(3), 237 (2011). crossref(new window)

16.
Y. G. Lee, J. G. Park, C. W. Lee and J. P. Jung, "Electrodeposition of the Sn-58wt.%Bi Layer for Low-Temperature Soldering", Met. Mater. Int., 17(1), 117 (2011). crossref(new window)

17.
M. H. Roh, J. P. Jung and W. J. Kim, "Electroplating Characteristics of Sn-Bi Microbumps for Low-Temperature Soldering", IEEE Transactions on componenets Packaging and Manufacturing Technology, 3(4), 566 (2013). crossref(new window)

18.
S. C. Hong, Santosh Kumar, D. H. Jung, W. J. Kim and J. P. Jung, "High Speed Cu-Ni Filling into TSV for 3-Dimensional Si Chip Stacking", Met. Mater. Int., 18(1), 123 (2013).

19.
W. H. Song, Ali Karimi, Wan Huang, Michael Mayer, Norman Zhou and J. P. Jung, "Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls", J. Electronic Packaging, 131, Dec. (2009).

20.
M. H. Roh, Ashutosh Sharma, J. H. Lee and J. P. Jung, "Extrusion Suppression of TSV Filling Metal by Cu-W electroplating for Three-Dimensional Microelectronic Packaging", Metall. and Mat. Trans. A (2015).

21.
M. H. Roh, H. Y. Lee, W. J. Kim and J. P. Jung, "Fabrication and Characteristics of electroplated Sn-0.7Cu Micro-bumps for Flip-Chip Packaging", Kor. J. Met. Mater., 49(5), 411 (2011).

22.
S. J. Hong, S. C. Hong, W. J. Kim and J. P. Jung, "Copper Filling to TSV(Through-Si-Via) and Simplification of Bumping Process", J. Microelectron. Packag. Soc., 17(3), 79 (2010).

23.
J. H. Bang, D. Y. Yu, Y. H. Ko, J. H. Kim and C. W. Lee, "Joint Property of Sn-Cu-Cr(Ca) Middle Temperature Solder for Automotive Electronic Module", Journal of KWJS, 31(5), 54 (2013).

24.
Santosh Kumar, Shalu Agarwal and J. P. Jung, "Soft Error Issue and Importance of Low Alpha Solders for Microelectronics Packaging", Rev. Adv. Mater. Sci., 34, 185 (2013).

25.
Santosh Kumar, D. H. Jung and J. P. Jung, "Wetting behavior and elastic properties of low alpha SAC105 and pure Sn solder", J. Mater. Sci. Tater. Electron., 24(6), 1748 (2013). crossref(new window)

26.
J. S. Kim, W. R. Myung and S. B. Jung, "Effect of Aging treatment and Epoxy on Bonding Strength of Sn-58Bi solder nad OSP-finished PCB", J. Microelectron. Packag. Soc., 21(4), 97 (2014.) crossref(new window)