Publisher : The Korean Microelectronics and Packaging Society
DOI : 10.6117/kmeps.2015.22.4.105
Title & Authors
Analyses on Airbag Sensor Signals by Different Packaging Kim, Yeong K.; Kang, Hyun Jin; Kim, Joon Ki;
In this study, a new airbag sensor packaging technique of directly attachment by adhesive to the automobile frame is introduced. To assess the feasibility for the packaging, a test instrument was manufactured to examine the impact sensibility by drop tests. The conventional sensor module attached mechanically by bolts with plastic housing and the new sensor packaging were installed to aluminum channel, and the results were compared with each other. Numerical analysis was also performed to investigate the signal characteristics created by the sensors. The preliminary results showed that the pattern of the MEMS sensor signal was strongly dependent on the structural behavior of the frame where the sensors were installed, which indicated the complexity of the packaging design for proper airbag deployments.
Airbag sensor;Module packaging;MEMS sensor;
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