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A Study on Heat Transfer Characteristics of PCBs with a Carbon CCL
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 Title & Authors
A Study on Heat Transfer Characteristics of PCBs with a Carbon CCL
Cho, Seunghyun; Jang, Junyoung; Kim, Jeong-Cheol; Kang, Suk Won; Seong, Il; Bae, Kyung Yun;
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 Abstract
In this paper, the heat transfer characteristics of PCB (Printed Circuit Board) with cabon CCL (Copper Claded Layer) were studied through experiments and numerical analysis to compare of PCBs with conventional the FR-4 core and heavy copper cores. For study, samples are producted with HDI (High Density Interconnection) PCB of mobile phone with variations of thickness of core materials and grades of carbon material to evaluate heat transfer characteristics respectively. From this research results, heat transfer characteristics of the carbon core was rather low than heavy copper, but better than FR-4 core. In addition, even though the carbon and heavy copper core contributed on the heat transfer characteristics as their thickness increases, FR-4 cores disturbed heat transfer characteristics as it's thickness increases. Therefore, carbon core is recommendable to improve the heat transfer characteristics of the PCB because heavy copper core has much disadvantages such as increasing of wear of drill, the weight of PCB, and manufacturing cost by additional insulation materials for electrical insulation.
 Keywords
Carbon CCL;Heat transfer;PCBs;Experiments;FEM;
 Language
Korean
 Cited by
 References
1.
A. Bar-Cohen, "Thermal management of microelectronics in the 21st century", IEEE/CPMT Electron Packaging Technology Conference, 29 (1997).

2.
Q. Zou, Y. Miao, Y. Chen, U. Sridhar, C. S. Chong, T. Chai, Y. Tie, C. H. L. Teh, T. M. Lim and C. K. Heng, "Microassembled multi-chamber thermal cycler for low-cost reaction chip thermal multiplexing", Sensors and Actuators A: Physical, 102(1-2), 114 (2002).

3.
Z. Zhao, "Thermal design of a broadband communication system with detailed modeling of TBGA packages," Microelectron. Reliab., 43(5), 785 (2003). crossref(new window)

4.
T. Zhou, M. Hundt, C. Vila, R. Bond and T. Lao, "Thermal Study for Flip Chip on FR-4 Boards", Proc. 47th Electronic Componets and Technology Conference (ECTC), 879 (1997).

5.
S. R. J. Axelsson, "Improved Fourier modelling of soil temperature using the fast Fourier transform algorithm", IEEE T. Geoscience and Remote Sensing, 1, 79 (1997).

6.
S. H. Cho ans J. Y. Lee, "Heat dissipation of printed circuit board by the high thermal conductivity of photo-imageable solder resist", Electronic Materials Letters., 6(4), 167 (2011).

7.
S. H. Cho, "Heat dissipation effect of Al plate embedded substrate in network system", Microelectronics Reliability, 48(10), 1696 (2008). crossref(new window)

8.
X. J. Fan, "Combined thermal and thermomechanical modeling for a multichip QFN package with metal-core printed circuit board", The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), 2, 377 (2004).

9.
X. J. Fan and S. Haque, "Emerging MOSFET packaging technologies and their thermal evaluation", Proc. 8th Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), San Diego, 1102 (2002).

10.
R. Lee, "An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool", IEEE Transactions on Components and Packaging Technologies, 23(3), 481 (2000). crossref(new window)

11.
J. Lohan, V. Eveloy and P. Rodgers, "Visualization of Forced Air Flows over a Populated Printed Circuit Board and Their Impact on Convective Heat Transfer", Proc. 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), San diego, 501, IEEE (2002).

12.
B. Chamber, T.-Y. T. Lee and W. Blood, "Steady State and Trasient Thermal Analysis of Chip Scale Packages", Journal of Electronics Manufacturing, 9(2), 131 (1999). crossref(new window)

13.
S. H. Cho and E. T. Chang, "Thermo-mechanical Behavior Characteristic Analysis of B2it(Buried Bump Interconnection Technology) in PCB (Printed Circuit Board)", J. Microelectron. Packag. Soc., 19(3), 57 (2009).

14.
MARC 2014 user manual, Volume A : Theory and user information, (2014).