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A Study on Heat Transfer Characteristics of PCBs with a Carbon CCL
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 Title & Authors
A Study on Heat Transfer Characteristics of PCBs with a Carbon CCL
Cho, Seunghyun; Jang, Junyoung; Kim, Jeong-Cheol; Kang, Suk Won; Seong, Il; Bae, Kyung Yun;
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In this paper, the heat transfer characteristics of PCB (Printed Circuit Board) with cabon CCL (Copper Claded Layer) were studied through experiments and numerical analysis to compare of PCBs with conventional the FR-4 core and heavy copper cores. For study, samples are producted with HDI (High Density Interconnection) PCB of mobile phone with variations of thickness of core materials and grades of carbon material to evaluate heat transfer characteristics respectively. From this research results, heat transfer characteristics of the carbon core was rather low than heavy copper, but better than FR-4 core. In addition, even though the carbon and heavy copper core contributed on the heat transfer characteristics as their thickness increases, FR-4 cores disturbed heat transfer characteristics as it's thickness increases. Therefore, carbon core is recommendable to improve the heat transfer characteristics of the PCB because heavy copper core has much disadvantages such as increasing of wear of drill, the weight of PCB, and manufacturing cost by additional insulation materials for electrical insulation.
Carbon CCL;Heat transfer;PCBs;Experiments;FEM;
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