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A Method for Application of Ammonium-based Pretreatment Solution in Preparation of Copper Flakes Coated by Electroless Ag Plating
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 Title & Authors
A Method for Application of Ammonium-based Pretreatment Solution in Preparation of Copper Flakes Coated by Electroless Ag Plating
Kim, Ji Hwan; Lee, Jong-Hyun;
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In order to prepare a low-cost conductive filler material possessing improved anti-oxidation property, Ag-coated Cu flakes were fabricated and the effects of an applying method of ammonium-based pretreatment solution on the Cu flakes were analyzed. The pretreatment solution was used to remove the surface oxide layer on Cu flake. During a single-stage pretreatment process, hole-shaped defects were formed on the flake surface during the pretreatment after 2 min, and the number and size increased in proportion to the pretreatment time. In the case that Ag plating solution was injected in the pretreatment solution after the pretreatment for 2 min, the defects were also formed during Ag plating. In contrast, the defects tremendous decreased in the case that the pretreatment solution was removed after the first pretreatment for 2 min and the Ag plating proceeded after the second pretratment using a low concentration pretreatment solution. As the final result, the 15 wt% Ag-coated Cu flake sample which was fabricated using the single-stage pretreatment oxidized at , but the sample fabricated by the double-stage pretreatment oxidized at , indicating definitely improved anti-oxidation property.
Ag-coated Cu flake;conductive filler;electroless silver plating;pretreatment;anti-oxidation;
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J.-S. Park, J.-H. Hwang, J.-G. Kim, Y.-H. Kim, H.-D. Park and S.-G. Kang, "Properties of Ag Thick Films Fabricated by Using Low Temperature Curable Ag Pastes", Kor. J. Mater. Res., 13(1), 18 (2003). crossref(new window)

H. S. Kim, J. C. Choi, B. O. Rhee and S. C. Choi, "Preparation and Characterization of Bi Based Frit for Ag Electrode in PDP Application", J. Microelectron. Packag. Soc., 10(4), 47 (2003).

J.-K. Lee, S.-H. Park and G.-S. Yang, "Effect of Sintering Aid and Glass-Frit on the Densification and Resistivity of Silver Paste", Kor. J. Mater. Res., 18(5), 283 (2008). crossref(new window)

L. Tongxiang, G. Wenli, Y. Yinghui and T. Chunhe, "Electroless Plating of Silver on Graphite Powders and the Study of Its Conductive Adhesive", Int. J. Adh. Adh. 28(1-2), 55 (2008). crossref(new window)

S. Wu, "Preparation of Fine Copper Powder Uusing Ascorbic Acid as Reducing Agent and Its Aapplication in MLCC", Mater. Lett., 61(4-5), 1125 (2007). crossref(new window)

X. Xu, X. Luo, H. Zhuang, W. Li and B. Zhang, "Electroless Silver Coating on Fine Copper Powder and Its Effects on Oxidation Resistance", Mater. Lett., 57(24-25), 3987 (2003). crossref(new window)

D. S. Jung, H. M. Lee, Y. C. Kang and S. B. Park, "Air-stable Silver-coated Copper Particles of Sub-micrometer Size', J. Colloid Interface Sci., 364(2), 574 (2011). crossref(new window)

J. Zhao, D. M. Zhang and J. Zhao, "Fabrication of Cu-Ag Core-Shell Bimetallic Superfine Ppowders by Eco-friendly Reagents and Structures Characterization", J. Solid State Chem., 184(9), 2339 (2011). crossref(new window)

H. T. Hai, J. G. Ahn, D. J. Kim, J. R. Lee, H. S. Chung and C. O. Kim, "Developing Process for Coating Copper Particles with Silver by Electroless Plating Method", Surf. Coat. Technol., 201(6), 3788 (2006). crossref(new window)

R. Zhang, W. Lin, K. Lawrence and C. P. Wong, "Highly Reliable, Low Cost, Isotropically Conductive Adhesives Filled with Ag-coated Cu Flakes for Electronic Packaging Applications", Int. J. Adh. Adh. 30(6), 403 (2010). crossref(new window)

Y. Peng, C. Yang, K. Chen, S. R. Popuri, C.-H. Lee and B.- S. Tang, "Study on Synthesis of Ultrafine Cu-Ag Core-Shell Powders with High Electrical Conductivity", Appl. Surf. Sci., 263(15), 38 (2012). crossref(new window)

G. Kim, K.-M. Jung, J.-T. Moon and J.-H. Lee, "Electrical Resistivity and Thermal Conductivity of Paste Containing Ag-coated Cu Flake Filler", J. Microelectron. Packag. Soc., 21(4), 51 (2014).

J. H. Kim and J.-H. Lee, "Effects of Pretreatment and Ag Coating Processes Conditions on the Properties of Ag-Coated Cu Flakes", J. Mater. Res., 24(11), 617 (2014).

Y. Wei, S. Chen, Y. Lin, Z. Yang and L. Liu, "Cu-Ag Core- Shell Nanowires for Electronic Skin with a Petal Molded Microstructure", J. Mater. Chem. C, 3(37), 9594 (2015). crossref(new window)

J. H. Kim, Y. H. Cho and J.-H. Lee, "Fabrication of a Ultrathin Ag Film on a Thin Cu Film by Low-Temperature Immersion Plating in an Grycol-Based Solution", J. Microelectron. Packag. Soc., 21(2), 79 (2014). crossref(new window)

D. W. Shoesmith, S. Sunder, M. G. Bailey, G. J. Wallace and F. W. Stanchell, "Anodic Oxidation of Copper in Alkaline Solutions: Part IV. Nature of the Passivating Film", J. Electroanal. Chem., 143(1-2), 153 (1983). crossref(new window)

G.-L. Song, R. Mishra and Z. Xu, "Crystallographic Orientation and Electrochemical Activity of AZ31 Mg Alloy", Electrochem Comm., 12(8), 1009 (2010). crossref(new window)

A. Muzikansky, P. Nanikashvili, J. Grinblat and D. Zitoun, "Ag Dewetting in Cu@Ag Monodisperse Core-Shell Nanoparticles", J. Phys. Chem. C, 117(6), 3093 (2013).

C.-H. Tsai, S.-Y. Chen, J.-M. Song, I.-G. Chen and H.-Y. Lee, "Thermal Stability of Cu@Ag Core-Shell Nanoparticles", Corros. Sci., 74(Sep), 123 (2013). crossref(new window)

S.-S. Chee and J.-H. Lee, "Preparation and Oxidation Behavior of Ag-coated Cu Nanoparticles Less Than 20 nm in Size", J. Mater. Chem. C, 2(27), 5372 (2014). crossref(new window)