Advanced SearchSearch Tips
Evaluation of Thermal Conductivity for Screen-Printed AlN Layer on Al Substrate in Thickness Direction
facebook(new window)  Pirnt(new window) E-mail(new window) Excel Download
 Title & Authors
Evaluation of Thermal Conductivity for Screen-Printed AlN Layer on Al Substrate in Thickness Direction
Kim, Jong-Gu; Park, Hong-Seok; Kim, Hyun; Hahn, Byung-Dong; Cho, Young-Rae;
  PDF(new window)
A study on thermal properties for a single-layer metal and two-layer composites was investigated for the heat-sink application. For the single-layer metal, an aluminum alloy (Al6061) was selected. A screen printed aluminum nitride (AlN) layer on the Al6061 substrate was chosen for the two-layer composites. The thermal conductivity of the sample was determined from the thermal diffusivity measured by the light flash analysis (LFA), specific heat and density. Measured thermal property values were compared to calculated values using the data from the references. The thermal conductivity of composites with screen printed AlN layer on the Al6061 substrate decreased linearly with increasing the thickness of AlN layer. Measured values of the thermal conductivity for composites with and thick AlN layers were and , respectively. In particular, the thermal conductivity of the screen-printed AlN layer was demonstrated by appling the rule of mixture in view point of thermal resistivity. Measured values of the thermal conductivity for AlN layers with the thickness of and showed and , respectively.
thick film;thermal conductivity;aluminum nitride;composites;screen print;
 Cited by
금속기판에 유전체 후막을 형성시켜 제조한 2층 층상재료에서 두께 방향의 열전도 특성,김종구;정주영;주재훈;박상희;조영래;

마이크로전자및패키징학회지, 2016. vol.23. 4, pp.87-92 crossref(new window)
W. Suh, H. S. Jung, Y. H. Lee, Y. H. Kim and S. H. Choa, "Heat Dissipation Technology of IGBT Module Package", J. Microelectron. Packag. Soc., 21(3), 7 (2014).

Y. J. Heo, H. T. Kim, K. J. Kim, S. Nahm, Y. J. Yoon and J. Kim, "Enhanced Heat Transfer by Room Temperature Deposition of AlN Film on Aluminum for a Light Emitting Diode Package", Appl. Therm. Eng., 50, 799 (2013). crossref(new window)

I. G. Kim, M. E. Son and Y. S. Kim, "Fabrication of the Cu-STS-Cu Clad Metal for High Strength Electric Device Lead Frame and Thermal Stability on Their Physical Properties", Journal of KWJS, 32(5), 80 (2014).

W. Feng, L. Zhang, Y. Liu, X. Li, L. Cheng and B. Chen, "Thermal Mechanical Properties of SiC/SiC-CNTs Composites Fabricated by CVI Combined with Electrophoretic Deposition", Mater. Sci. Eng., A626, 500 (2015).

S. M. Na, S. I. Go and S. J. Lee, "Observation of Thermal Conductivity of Pressureless Sintered AlN Ceramics under Control of $Y_2O_2$ Content and Sintering Condition", J. Kor. Ceram. Soc., 48(5), 368 (2011). crossref(new window)

Y. W. Kim, H. C. Park and K. D. Oh, "Effect of AlN Addition on the Thermal Conductivity of Sintered $Al_2O_3$", J. Kor. Ceram. Soc., 33(3), 285 (1996).

G. Kim, K. M. Jung, J. T. Moon and J. H. Lee, "Electrical Resistivity and Thermal Conductivity of Paste Containing Ag-Coated Cu Flake Filler", J. Microelectron. Packag. Soc., 21(4), 51 (2014).

J. W. Roh, S. Y. Jang, J. Kang, S. Lee, J. S. Noh, J. Park and W. Lee, "Thermal Conductivity in Individual Single-Crystalline PbTe Nanowires", Kor. J. Met. Mater., 48(2), 175 (2010). crossref(new window)

M. Abdel-Rahman, S. Ilahi, M. F. Zia, M. Debbar, N. Yacoubi and B. Ilahi, "Temperature Coefficient of Resistance and Thermal Conductivity of Vanadium Oxide 'Big Mac' Sandwich Structure", Infrared Phys. Technol., 71, 127 (2015). crossref(new window)

J. G. Kim, D. Y. Kim, H. Kim, B. D. Hahn and Y. R. Cho, "Effect of Interface on Thermal Conductivity of Clad Metal through Thickness Direction for Heat Sink", J. Microelectron. Packag. Soc., 22(3), 67 (2015). crossref(new window)

H. J. Ratzer-Scheibe, U. Schulz and T. Krell, "The Effect of Coating Thickness in the Thermal Conductivity of EB-PVD PYSZ Thermal Barrier Coations", Surf. Coat. Technol., 200, 5636 (2006). crossref(new window)

C. J. H. Helmereich, R. Corbin and S. M. McDeavitt, "Measurement of Thermal Diffusivity of Depleted Uranium Metal Microspheres", J. Nucl. Mater., 446, 100 (2014). crossref(new window)

K. Kuniya, H. Arkawa, T. Kanai and A. Chiba, "Thermal Conductivity, Electrical Conductivity and Specific Heat of Copper-Carbon Fiber Composites", Trans. Japan Inst. Metals, 28(10), 819 (1987). crossref(new window)

D. R. Askeland and P. P. Phule, The Science and Engineering of Materials 4th Ed., pp.731-736, Thomson, California (2008).

S. Kume, I. Yamada and K. Watari, "High-Thermal-Conductivity AlN Filler for Polymer/Ceramics Composites", J. Am. Ceram. Soc., 92(s1), S153 (2009). crossref(new window)

K. A. Khor, K. H. Cheng and L. G. Yu, F. Boey, "Thermal conductivity and dielectric constant of spark plasma sintered aluminum nitride", Mater. Sci. Eng., A347, 300 (2003).

Z. Gao and L. Zhao, "Effect of Nano-Fillers on the Thermal Conductivity of Epoxy Composites with Micro-$Al_2O_3$ Particles", Mater. Des., 66, 176 (2015). crossref(new window)

J. G. Kang, K. S. Hong and H. S. Yang, "Investigation of Film-Thickness Dependent Thermal Conductivity of $Gd_2Zr_2O_7$ Thin Films", Curr. Appl. Phys., 13, 1967 (2013). crossref(new window)

S. Shin, H. N. Cho, B. S. Kim and H. H. Cho, "Influence of Upper Layer on Measuring Thermal Conductivity of Multilayer Thin Films using Differential 3-$\omega$ Method", Thin Solid Films, 517, 933 (2008). crossref(new window)

G. W. Lee, M. Park, J. Kim, J. I. Lee and H. K. Yoon, "Enhanced Thermal Conductivity of Polymer Composites Filled with Hybrid Filler", Composites, A37, 727 (2006).

Y. Xu, D. D. L. Chung and C. Mroz, "Thermally Conducting Aluminum Nitride Polymer-Matrix Composites", Composites, A32, 1749 (2001).