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Reliability Assessment of Low-Power Processor Packages for Supercomputers
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 Title & Authors
Reliability Assessment of Low-Power Processor Packages for Supercomputers
Park, Ju-Young; Kwon, Daeil; Nam, Dukyun;
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 Abstract
While datacenter operation cost increases with electricity price rise, many researchers study low-power processor based supercomputers to reduce power consumption of datacenters. Reliability of low-power processors for supercomputers can be of concern since the reliability of many low-power processors are assessed based on mobile use conditions. This paper assessed the reliability of low-power processor packages based on supercomputer use conditions. Temperature cycling was determined as a critical failure cause of low-power processor packages through literature surveys and failure mode, effect and criticality analysis. The package temperature was measured at multiple processor load conditions to examine the relationship between processor load and package temperature. A physics-of-failure reliability model associated with temperature cycling predicted the expected lifetime of low-power processors to be less than 3 years. Recommendations to improve the lifetime of low-power processors were presented based on the experimental results.
 Keywords
Reliability;Supercomputers;Physics of failure;Low-power processors;Risk assessment;
 Language
Korean
 Cited by
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