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Effects of Different Pretreatment Methods and Amounts of Reductant on Preparation of Silver-coated Copper Flakes Using Electroless Plating
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 Title & Authors
Effects of Different Pretreatment Methods and Amounts of Reductant on Preparation of Silver-coated Copper Flakes Using Electroless Plating
Oh, Sang Joo; Kim, Ji Hwan; Lee, Jong-Hyun;
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 Abstract
In the preparation of Ag-coated Cu flakes using L-ascorbic acid as a reductant for the electroless Ag plating, the effects of pretreatment methods and the reductant concentration on the uniformity of Ag coating layer and the anti-oxidation property of Ag-coated Cu flakes during the heating in air were evaluated. It was found that the removal degree of surface oxide layer during the pretreatment has great influence on the uniformity of Ag coating layer and the formation degree of hole defects in the flakes has slight effect on the anti-oxidation property of Ag-coated Cu flakes. It was also verified that the reductant concentration has great influence on the coverage uniformity and thickness of Ag coating, thus it was could be considered a main process parameter. When the reductant concentration was 0.04 M, high-quality Ag-coated Cu flakes was obtained. When the concentration increased to 0.06 M, however, the anti-oxidation property of Ag-coated Cu flakes became remarkably worse owing to remnant of Cu surface non-coated with Ag by the formation of pure Ag fine particles.
 Keywords
electroless silver plating;Ag-coated Cu flake;pretreatment;reductant concentration;coating uniformity;
 Language
Korean
 Cited by
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