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Study on the Lapping Characteristics of Sapphire Wafer by using a Fixed Abrasive Plate
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  • Journal title : Tribology and Lubricants
  • Volume 32, Issue 2,  2016, pp.44-49
  • Publisher : The Korean Society of Tribologists and Lubrication Engineers
  • DOI : 10.9725/kstle.2016.32.2.44
 Title & Authors
Study on the Lapping Characteristics of Sapphire Wafer by using a Fixed Abrasive Plate
Lee, Taekyung; Lee, Sangjik; Jo, Wonseok; Jeong, Haedo; Kim, Hyoungjae;
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Diamond mechanical polishing (DMP) is a crucial process in a sapphire wafering process to improve flatness and achieve the target thickness by using free abrasives. In a DMP process, material removal rate (MRR) is a key factor to reduce process time and cost. Controlling mechanical parameters, such as velocity and pressure, can increase the MRR in a DMP process. However, there are limitations of using high velocities and pressures for achieving a high MRR owing to their side effects. In this paper, we present the lapping characteristics and improvement of MRR by using a fixed abrasive plate through an experimental study. The change in MRR as a function of velocity and pressure follows Preston`s equation. The surface roughness of a wafer decreases as the plate velocity and pressure increases. We observe a sharp decrease in MRR over the lapping time at a high velocity and pressure in the velocity and pressure test. An analysis of surface roughness (Rq and Rpk) indicates that wear of abrasives decreases the MRR sharply. In order to investigate the effect of abrasive wear on the MRR, we utilize a cutting fluid and a rough wafer. The cutting fluid delays the wear of abrasives resulting in improvement of MRR drop. The rough wafer maintains the MRR at a stable rate by self-dressing.
fixed abrasive;free abrasive;lapping characteristic;self-dress;sapphire wafer;
 Cited by
XiaoKai Hu, Zhitang Song, Zhongcai Pan, Weili Liu, LiangCai Wu, “Planarization machining of sapphire wafers with boron carbide and colloidal silica as abrasives”, Applied Surface Science, Vol. 255, pp. 8230-8234, 2009. crossref(new window)

E. Rabinowicz, L. A. Dunn, P. G. Russell, “A study of abrasive wear under three-body conditions”, Wear, Vol. 4, pp. 345-371, 1961. crossref(new window)

H. M. Kim, G. H. Park, Y. G. Seo, D. J. Moon, B. J. Cho, J. G. Park., “Comparison between sapphire lapping processes using 2-body and 3-body modes as a function of diamond abrasive size”, Wear, Vol. 332, pp. 794-799, 2015.

B. J. Cho, H. M. Kim, R. Manivannan, D. J. Moon, J.G. Park “On the mechanism of material removal by fixed abrasive lapping of various glass substrates”, Wear, Vol. 302, pp. 1334-1339, 2013. crossref(new window)

J. Y. Choe, H. Y. Kim, J. H. Park, H. D. Jeong. “A Study on Nano-polishing of Injection Molds using Fixed Abrasive Pad”, J. Korean Soc. Precision Eng., Vol. 19, pp. 212-220, 2002.

F. W. Preston, “The theory and design of plate glass polishing machines”, J. Soc. of Glass Tech., Vol. 11, 1927.

W. I. Clark, A. J. Shih, C. W. Hardin, R. L. Lemaster, S. B. McSpadden, “Fixed abrasive diamond wire machining—part I: process monitoring and wire tension force”, J. of Machine Tools and Manufacture, Vol. 43, pp. 523-532, 2003. crossref(new window)

N. P. Hung, S. H. Yeo, B. E. Oon, “Effect of cutting fluid on the machinability of metal matrix composites.” J. Materials Processing Technology, Vol. 67, pp. 167-161, 1997. crossref(new window)