Advanced SearchSearch Tips
A Study of Material Removal Characteristics by Friction Monitoring System of Sapphire Wafer in Single Side DMP
facebook(new window)  Pirnt(new window) E-mail(new window) Excel Download
  • Journal title : Tribology and Lubricants
  • Volume 32, Issue 2,  2016, pp.56-60
  • Publisher : The Korean Society of Tribologists and Lubrication Engineers
  • DOI : 10.9725/kstle.2016.32.2.56
 Title & Authors
A Study of Material Removal Characteristics by Friction Monitoring System of Sapphire Wafer in Single Side DMP
Jo, Wonseok; Lee, Sangjik; Kim, Hyoungjae; Lee, Taekyung; Lee, Seongbeom;
  PDF(new window)
Sapphire has a high hardness and strength and chemical stability as a superior material. It is used mainly as a material for a semiconductor as well as LED. Recently, the cover glass industry used by a sapphire is getting a lot of attention. The sapphire substrate is manufactured through ingot sawing, lapping, diamond mechanical polishing (DMP) and chemical mechanical polishing (CMP) process. DMP is an important process to ensure the surface quality of several nm for CMP process as well as to determine the final form accuracy of the substrate. In DMP process, the material removal is achieved by using the mechanical energy of the relative motion to each other in the state that the diamond slurry is disposed between the sapphire substrate and the polishing platen. The polishing platen is one of the most important factors that determine the material removal characteristics in DMP. Especially, it is known that the geometric characteristics of the polishing platen affects the material removal amount and its distribution. This paper investigated the material removal characteristics and the effects of the polishing platen groove in sapphire DMP. The experiments were preliminarily carried out to evaluate the sapphire material removal characteristics according to process parameters such as pressure, relative velocity and so on. In the experiment, the monitoring apparatus was applied to analyze process phenomena in accordance with the processing conditions. From the experimental results, the correlation was analyzed among process parameters, polishing phenomena and the material removal characteristics. The material removal equation based on phenomenological factors could be derived. And the experiment was followed to investigate the effects of platen groove on material removal characteristics.
sapphire wafer;diamond mechanical polishing;material removal rate;friction monitoring system;
 Cited by
Toshiro K. Doi, Toshio Kasai, Hans K. Tonshoff, “Lapping and Polishing”, Handbook of Ceramic Grinding & Polishing, 1999, pp. 354-442.

S. W. Hwang, G. S. Shing, K. J. Kim, N. S. Suh, “A Study on the Micro-Lapping Process of Sapphire Wafers for Optoelectronic Devices”, Journal of Korean Society of Precision Engineering, Vol. 21, No. 2, 2004.

Yoshio Homma, “Effects of Mechanical Parameters on CMP characteristics Analyzed by Two-Dimensional Frictional-Force Measurement”, Journal of The Electrochemical Society, 2003, pp. 751-757.

F. W. Preston, “The Theory and Design of Plate Glass Polishing Machine”, Journal of The Society of Glass Technology, Vol. 11, 1927, pp. 214-256.