JOURNAL BROWSE
Search
Advanced SearchSearch Tips
Thermal Analysis of APD Electronics for Activation of a Spaceborne X-band 2-axis Antenna
facebook(new window)  Pirnt(new window) E-mail(new window) Excel Download
 Title & Authors
Thermal Analysis of APD Electronics for Activation of a Spaceborne X-band 2-axis Antenna
Ha, Heon-Woo; Kang, Soo-Jin; Kim, Tae-Hong; Oh, Hyun-Ung;
  PDF(new window)
 Abstract
The thermal analysis of electronic equipment is required to predict the reliability of electronic equipment being loaded on a satellite. The transient heat transfer of electronic equipment that was developed recently has been generated using a large-scale integration circuit. If there is a transient heat transfer between EEE(Electric, Electronic and Electro mechanical) parts, it may lead to failure the satellite mission. In this study, we performed the thermal design and analysis for reliability of APD(Antenna Pointing Driver) electronics for activation of a spaceborne X-band 2-axis antenna. The EEE parts were designed using a thermal mathematical model without the thermal mitigation element. In addition, thermal analysis was performed based on the worst case for verifying the reliability of EEE parts. For the thermal analysis results, the thermal stability of electronic equipment has been demonstrated by satisfying the de-rating junction temperature.
 Keywords
Thermal Analysis;Electronic Equipment;EEE(Electric, Electronic and Electro-mechanical) Parts;Junction Temperature;
 Language
Korean
 Cited by
 References
1.
Gilmore, D. G., and Collins, R. L., "Satellite Thermal Control Handbook", 2nd Edition, The Aerospace Corp. Press, EI Segundo, CA, 2004

2.
H. S. Seo, J. Rhee, E. S. Han, I. S. Kim, "Thermal Failure of the LM117 Regulator under Harsh Space Thermal Environments", Aerospace Science and Technology, vol. 27, no. 1, June 2013

3.
M. H. Lee, D. W. Kim and Y. K. Chang, "A Study of High-power Dissipation Parts Modeling for Spacecraft PCB Thermal Analysis", The Korean Society for Aeronautical and Space Sciences, vol. 34, no. 6, pp. 42-50, June 2006.

4.
H. S. Seo, Y. G. Jeong, S. S. Jang, J. B. Jang, "Thermal Analysis of Power Electronic for Korea Low Earth Orbit Satellite", 2008 KSAS Spring Conference, Pyeongchang, Korea, pp. 948-951, April 2008.

5.
S. H. Kim, H. D. Kim, B. S. Hyeon, J. M. Choi, "Thermal Analysis of LEO Satellite RF Distribution Unit", 2008 KSAS Spring Conference, Hoengseong, Korea, pp. 888-891, April 2006.

6.
S. H. Jeon, S. C. Kwon, D. K. Kim and H. U. Oh, "Investigation of Micro-vibration Isolation Performance of SMA Mesh Washer Isolator for Vibration Isolation of X-band Antenna", The Korean Society for Aeronautical and Space Sciences, vol. 42, no. 11, pp. 988-995, November 2014. crossref(new window)

7.
Timothy D. Panczak, Steven G. Ring, Mark J. Welch, David Johnson, Brent A. Cullimore, Douglas P. Bell, "Sinda/Fluint Thermal Desktop User' Manual", C&R Technologies, October 2008.

8.
J. S. Jang, Y. H. Jeong, S. U. Yang and I. E. Kim, "Design Verification of Thermal Control Performance of Electronics for Small Electro-Optics", 2009 KSAS Spring Conference, Pyeongchang, Korea, pp. 734-737, April 2009.

9.
J. S. Jang, J. H. Yun, S. U. Yang and H. W. Lee, "Thermal Analysis and Result Review of Auxiliary Camera Module Unit for Small Electro-Optics for Earth Observation", 2011 KSAS Spring Conference, Gyeongju, Korea, pp. 1042-1046, April 2011.

10.
J. H. Park, H. S. Kim, H. S. Ko, B. C Jun and H. K. Seo, "Experimental Verification of Heat Sink for FPGA Thermal Control", The Korean Society for Aeronautical and Space Sciences, vol. 42, no. 9, pp. 789-794, September 2014. crossref(new window)