JOURNAL BROWSE
Search
Advanced SearchSearch Tips
Effect of Current Density and Solution pH on Properties of Electrodeposited Cu Thin Films from Sulfate Baths for FCCL Applications
facebook(new window)  Pirnt(new window) E-mail(new window) Excel Download
 Title & Authors
Effect of Current Density and Solution pH on Properties of Electrodeposited Cu Thin Films from Sulfate Baths for FCCL Applications
Shin, Dong-Yul; Park, Doek-Yong; Koo, Bon-Keup;
  PDF(new window)
 Abstract
Nanocrystalline Cu thin films for FCCL were electrodeposited from sulfate baths to investigate systematically the influences of current density, solution pH on current efficiency, residual stress, surface morphology, and microstructure of thin Cu films. Current efficiencies were measured to be approximately 100%, irrespective of the applied current density and solution pH. But these influenced residual stress, surface morphology, XRD pattern, and grain size of electrodeposited Cu thin film. The residual stress decreased with decreasing the surface roughness, but increased with increasing the fcc(111) peak strength of XRD patterns.
 Keywords
FCCL;Electrodeposition;Current density;pH;Sulfate bath;Residual stress;
 Language
Korean
 Cited by
1.
첨가제에 의한 구리 박막의 기계적 특성 변화,우태규;박일송;정광희;손규송;송람;이만형;황영규;설경원;

대한금속재료학회지, 2012. vol.50. 3, pp.237-242 crossref(new window)
2.
피로인산구리용액으로부터 전기도금 된 Cu 필름의 특성에 미치는 도금조건의 영향,신동율;심철용;구본급;박덕용;

전기화학회지, 2013. vol.16. 1, pp.19-29 crossref(new window)
3.
Effect of Additives on the Elongation and Surface Properties of Copper Foils,;;;

Electronic Materials Letters, 2013. vol.9. 3, pp.341-345 crossref(new window)
4.
The Effect of Additives and Current Density on Mechanical Properties of Cathode Metal for Secondary Battery,;;;

Electronic Materials Letters, 2013. vol.9. 4, pp.535-539 crossref(new window)
1.
Effect of additives on the elongation and surface properties of copper foils, Electronic Materials Letters, 2013, 9, 3, 341  crossref(new windwow)
2.
The effect of additives and current density on mechanical properties of cathode metal for secondary battery, Electronic Materials Letters, 2013, 9, 4, 535  crossref(new windwow)
3.
Effect of Deposition Conditions on Properties of Cu Thin Films Electrodeposited from Pyrophosphate Baths, Journal of the Korean Electrochemical Society, 2013, 16, 1, 19  crossref(new windwow)
 References
1.
D. H. Lee, Polymer (Korea), 11 (1987) 206

2.
D.-Y. Park, K. S. Park, J. M. Ko, D.-H. Cho, S. H. Lim, W. Y. Kim, B. Y. Yoo, N. V. Myung, J. Electrochem. Soc., 153(12) (2006) C814 crossref(new window)

3.
M. Schlesinger, M. Paunovic, Modern Electroplating, 4th ed., John Wiley & Sons, Inc., 2000, pp.63-103

4.
V. A. Lamb, C. E. Johnson, D. R. Valentine, J. Electrochem. Soc., 117 (1970) 291C crossref(new window)

5.
V. A. Lamb, C. E. Johnson, D. R. Valentine, J. Electrochem. Soc., 117 (1970) 341C crossref(new window)

6.
V. A. Lamb, C. E. Johnson, D. R. Valentine, J. Electrochem. Soc., 117 (1970) 381C crossref(new window)

7.
V. DeNora, Met. Ital., 31 (1939) 607; Chem. Abstr., 35 (1940) 5797

8.
L. L. Shreir, J. W. Smith, J. Electrochem. Soc., 99 (1952) 64 crossref(new window)

9.
L. L. Shreir, J. W. Smith, J. Electrochem. Soc., 99 (1952) 450 crossref(new window)

10.
A. Butts, V. DeNora, Trans. Electrochem. Soc., 79 (1941) 163 crossref(new window)

11.
D.-Y. Park, N. V. Myung, M. Schwartz, K. Nobe, Electrochim. Acta, 47 (2002) 2893 crossref(new window)

12.
J. W. Cuthbertson, Trans. Electrochem. Soc., 77 (1940) 157 crossref(new window)

13.
W. A. Wood, Proc. Phys. Soc. (London), 43 (1931) 138 crossref(new window)