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Preparation of Pt Films on GaAs by 2-step Electroless Plating
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 Title & Authors
Preparation of Pt Films on GaAs by 2-step Electroless Plating
Im, Hung-Su; Seo, Yong-Jun; Kim, Young-Joo; Wang, Kai; Byeon, Sang-Sik; Koo, Bon-Heun; Chang, Ji-Ho;
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 Abstract
Electroless plating is influenced by kinds of parameters including concentrations of electrolyte, plating time, temperature and so on. In this study, the Pt thin films were prepared on GaAs substrate by a 2-step electroless plating depending method. The small Pt catalytic particles by using Pt I bath exhibited islands-morphology dispersed throughout the substrate surface at , as function as a sensitized thin film, and then a thicker Pt film grew upon the sensitized layer by the second Pt II bath. As the growth of Pt film is strongly influenced by the plating time and temperature, the plating time of Pt II bath varied from 5 min to 40 min at after Pt I bath at for 5 min. It is found that the film grows with the increasing plating time and temperature. The resistivity value of Pt deposited layer was characterized to study the growth mechanism of 2-step plating.
 Keywords
Pt/GaAs;Electroless plating;2-step plating;FESEM;I-V;
 Language
English
 Cited by
 References
1.
M. Murakami, Mater. Sci. Rep., 5 (1990) 273 crossref(new window)

2.
D. Lamouche, J. R. Martin, P. Clechet, G. Haroutiounian, J. P. Sandino, Solid-state Electro., 29 (1986) 625 crossref(new window)

3.
H. Chen, C. Hsiung, Y. Chou, Semicond. Sci. Technol., 18 (2003) 620

4.
L. Lewis, D. P. Casey, A. V. Jeyaseelan, J. F. Rohan, P. P. Maaskant, Appl. Phys. Lett., 92 (2008) 062113-1-3 crossref(new window)

5.
G. Stremsdoerfer, J. R. Martin, P. Clechet, Nguyen-Du, J. Eletrochem. Soc., 137 (1990) 256 crossref(new window)

6.
C. Flores, Solar Cell., 9 (1983) 169 crossref(new window)

7.
J. Shu, B. P. A. Grandjean, E. Ghali, S. Kaliaguine, J. Eletrochem. Soc., 140 (1993) 3175 crossref(new window)

8.
R. Chepuri, K. Rao, D. C. Trivedi, Coordin. Chem. Rev., 249 (2005) 613

9.
W. L. Liu, W. J. Chen, T. K. Tsai, S. H. Hsieh, S. Y. Chang, Appl. Surf. Sci., 253 (2007) 3843 crossref(new window)

10.
T. Tsai, C. Chao, Appl. Surf. Sci., 233 (2004) 180 crossref(new window)

11.
G. O. Mallory, J. B. Hajdu, Electroless Plating: Fundamentals and Applications, American Electroplaters and Surface Finishers Society. Chapter 12, William Andrew Publishing/Noyes, Brick, New Jersey (1990) 289

12.
J. H. Kim, S. I. Woo, Chem. Mater., 10 (1998) 3576 crossref(new window)