Effect of Cu2+ Concentration and Additives on Properties of Electrodeposited Cu Thin Films for FCCL from Sulfate Baths

Title & Authors
Effect of Cu2+ Concentration and Additives on Properties of Electrodeposited Cu Thin Films for FCCL from Sulfate Baths
Shin, Dong-Yul; Park, Doek-Yong; Koo, Bon-Keup;

Abstract
Nanocrystalline Cu thin films were electrodeposited from sulfate baths and investigated systematically the influences of $\small{Cu^{2+}}$ concentration and additives on current efficiency, residual stress, surface morphology, and XRD patterns of electrodeposited Cu film. Current efficiency was nearly 100% at from 0.2M to 1.0 M $\small{Cu^{2+}}$ concentration. but it was linearly increased with $\small{Cu^{2+}}$ concentration at less than 0.2M. The residual stress was observed in range of 7.9 to 18.4 MPa and tensile stress mode. Dendritic and powdered form was obtained at below 0.1 M. As increased with $\small{Cu^{2+}}$ concentration in solution, the main peak in the XRD pattern shifted (111) and (220) from (200). In the other hand, all about 100% current efficiency observed in all additive concentration systems, and residual stress observed in range of 20.4 to 26.3 MPa tensile stress. The condition 5(Ultra make-up - 10 ml/l, Ulta A - 0.5ml/l, Ultr B - 0.5 ml/l) was good surface morphology, and fcc(111) peak in XRD patterns increased with increasing additive concentration.
Keywords
FCCL;Electrodeposite;Sulfate bath;Current efficiency;Residual stress;Surface morphology;
Language
Korean
Cited by
1.
Influence of Chemical Composition of Pyrophosphate Copper Baths on Properties of Electrodeposited Cu Films, Journal of the Korean Electrochemical Society, 2015, 18, 1, 7
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