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Comparison of Acidic and Alkaline Bath in Electroless Nickel Plating on Porous Carbon Substrate
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 Title & Authors
Comparison of Acidic and Alkaline Bath in Electroless Nickel Plating on Porous Carbon Substrate
Chun, So-Young; Kang, In-Seok; Rhym, Young-Mok; Kim, Doo-Hyun; Lee, Jae-Ho;
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 Abstract
Electroless nickel plating on porous carbon substrate for the application of MCFC electrodes was investigated. Acidic and alkaline bath were used for the electroless nickel plating. The pore sizes of carbon substrates were 16-20 and over 20 . The carbon surface was changed from hydrophobic to hydrophilic after immersing the substrate in an ammonia solution for 40 min at . The contact angle of water was decreased from to less than after ammonia pretreatment. The deposition rate in the alkaline bath was higher than that in the acidic bath. The deposition rate was increased with increasing pH in both acidic and alkaline bath. The content of phosphorous in nickel deposit was decreased with increasing pH in both acidic and alkaline bath. The contents of phosphorous is low in alkaline bath. The minimum concentration of for the electroless nickel plating was 10 ppm in alkaline bath and 5 ppm in acidic bath. The thickness of nickel was not affected by the concentration of .
 Keywords
Electroless nickel plating;Porous carbon;Palladium chloride;
 Language
Korean
 Cited by
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