Publisher : The Korean Institute of Surface Engineering
DOI : 10.5695/JKISE.2010.43.3.142
Title & Authors
Evaluation of ENEPIG Surface Treatment for High-reliability PCB in Mobile Module Lee, Joon-Kyun; Yim, Young-Min; Seo, Jun-Ho;
We evaluated characteristics of ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) surface treatment for mobile equipment that requires high reliability, in addition to investigating surface treatment processes for semiconductor boards that require high reliability such as regular PCB-package systems, board-on-chip, chip-scaled package (CSP), etc and application for semiconductor package board of SIP, BOC. As a result, it appeared that ENEPIG has superior properties compared to ENIG surface treatment in corrosion resistance, solder junction, wetting, etc. We anticipate that these results will be able to lend credibility to ENEPIG as a low-cost alternative for producing mobile devices such as the cell phones, especially when applied to mass production.