JOURNAL BROWSE
Search
Advanced SearchSearch Tips
Evaluation of ENEPIG Surface Treatment for High-reliability PCB in Mobile Module
facebook(new window)  Pirnt(new window) E-mail(new window) Excel Download
 Title & Authors
Evaluation of ENEPIG Surface Treatment for High-reliability PCB in Mobile Module
Lee, Joon-Kyun; Yim, Young-Min; Seo, Jun-Ho;
  PDF(new window)
 Abstract
We evaluated characteristics of ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) surface treatment for mobile equipment that requires high reliability, in addition to investigating surface treatment processes for semiconductor boards that require high reliability such as regular PCB-package systems, board-on-chip, chip-scaled package (CSP), etc and application for semiconductor package board of SIP, BOC. As a result, it appeared that ENEPIG has superior properties compared to ENIG surface treatment in corrosion resistance, solder junction, wetting, etc. We anticipate that these results will be able to lend credibility to ENEPIG as a low-cost alternative for producing mobile devices such as the cell phones, especially when applied to mass production.
 Keywords
ENIG(electroless Nickel Immersion Gold);ENEPIG(Electroless Nickel Electroless Palladium Immersion Gold);Solder;PCB;MTO;
 Language
English
 Cited by
 References
1.
Ray Taheri, Evaluation of Electoless Nickel-Phosphorus (EN) Coating (2003).

2.
Halliday, Resnick, Walker, Fundamentals of Physics, 5E, Extended, Wiley (1997).

3.
Duncan, The Engineering Properties of Electroless Nickel Coating (1996).

4.
T. N. Khoperia, Microelectronic Engineering, Vol. 69 (2003) 391. crossref(new window)