Publisher : The Korean Institute of Surface Engineering
DOI : 10.5695/JKISE.2010.43.6.266
Title & Authors
Effect of Copper Content on the Microstructural Properties of Mo-Cu-N Films Shin, Jung-Ho; Choi, Kwang-Soo; Wang, Qi-Min; Kim, Kwang-Ho;
Ternary Mo-Cu-N films were deposited on Si wafer substrates with various copper contents by magnetron sputtering method using Mo target and Cu target in gaseous atmosphere. As increasing pressure, the microstructure of Mo-N films changed from of (111) having face-centered-cubic (FCC) structure to -MoN of (200) having hexagonal structure. Detailed the microstructures of the Mo-Cu-N coatings were studied by X-ray diffraction, scanning electron microscopy and field emission transmission electron microscope. The results indicated that the incorporation of copper into the growing Mo-N coating led to the and MoN crystallites were more well-distributed and refined and the copper existed in grain boundary. Ternary Mo-Cu-N films had a composite microstructure of the nanosized crystal crystalline and -MoN surrounded by amorphous phase.